Issued Patents 2003
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6670214 | Insulated bonding wire for microelectronic packaging | Owai H. Low, Ramaswamy Ranganathan | 2003-12-30 |
| 6603200 | Integrated circuit package | Qwai H. Low, Seng-Sooi Lim | 2003-08-05 |
| 6525421 | Molded integrated circuit package | Seng-Sooi Lim, Wee Liew | 2003-02-25 |
| 6519844 | Overmold integrated circuit package | Kumar Nagarajan, Seng-Sooi Lim | 2003-02-18 |
| 6512293 | Mechanically interlocking ball grid array packages and method of making | Seng-Sooi Lim, Wee Liew | 2003-01-28 |