Issued Patents 2003
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6670214 | Insulated bonding wire for microelectronic packaging | Chok J. Chia, Owai H. Low | 2003-12-30 |
| 6573113 | Integrated circuit having dedicated probe pads for use in testing densely patterned bonding pads | Qwai H. Low, William T. Bright | 2003-06-03 |