Issued Patents 2003
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6608376 | Integrated circuit package substrate with high density routing mechanism | Aritharan Thurairajaratnam, Maniam Alagaratnam | 2003-08-19 |
| 6566167 | PBGA electrical noise isolation of signal traces | Aritharan Thurairajaratnam, Nadeem HAQUE | 2003-05-20 |
| 6525421 | Molded integrated circuit package | Chok J. Chia, Seng-Sooi Lim | 2003-02-25 |
| 6512293 | Mechanically interlocking ball grid array packages and method of making | Chok J. Chia, Seng-Sooi Lim | 2003-01-28 |