TW

Tien Y. Wu

IBM: 1 patents #1,943 of 5,539Top 40%
📍 Endwell, NY: #13 of 38 inventorsTop 35%
🗺 New York: #3,048 of 9,423 inventorsTop 35%
Overall (2003): #102,353 of 273,478Top 40%
1
Patents 2003

Issued Patents 2003

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
6558981 Method for making an encapsulated semiconductor chip module Miguel A. Jimarez, Marybeth Perrino, Son K. Tran 2003-05-06