Issued Patents 2003
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6639638 | LCD cover optical structure and method | Mark V. Pierson, William J. Rudik, David B. Stone | 2003-10-28 |
| 6596559 | Flip-chip package with optimized encapsulant adhesion and method | Luis J. Matienzo, Son K. Tran | 2003-07-22 |
| 6576996 | Method for bonding heat sinks to overmolds and device formed thereby | Frank D. Egitto, Michael A. Gaynes, Luis J. Matienzo, Mark V. Pierson | 2003-06-10 |
| 6517662 | Process for making semiconductor chip assembly | Thomas M. Culnane, Michael A. Gaynes, Mark V. Pierson, Charles G. Woychik | 2003-02-11 |