Issued Patents All Time
Showing 76–100 of 636 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11476213 | Bonded structures without intervening adhesive | Rajesh Katkar, Ilyas Mohammed, Javier A. Delacruz | 2022-10-18 |
| 11469214 | Stacked architecture for three-dimensional NAND | Stephen L. Morein, Javier A. Delacruz, Xu Chang, Rajesh Katkar | 2022-10-11 |
| 11462419 | Microelectronic assemblies | — | 2022-10-04 |
| 11424211 | Package-on-package assembly with wire bonds to encapsulation surface | Hiroaki Sato, Teck-Gyu Kang, Philip R. Osborn, Wei-Shun Wang, Ellis Chau +6 more | 2022-08-23 |
| 11404439 | 3D NAND—high aspect ratio strings and channels | Rajesh Katkar, Xu Chang | 2022-08-02 |
| 11393779 | Large metal pads over TSV | Guilian Gao, Bongsub Lee, Gaius Gillman Fountain, Jr., Cyprian Emeka Uzoh, Laura Wills Mirkarimi +1 more | 2022-07-19 |
| 11385278 | Security circuitry for bonded structures | Javier A. Delacruz, Guy Regev | 2022-07-12 |
| 11387202 | Nanowire bonding interconnect for fine-pitch microelectronics | Ilyas Mohammed | 2022-07-12 |
| 11373963 | Protective elements for bonded structures | Javier A. Delacruz, Rajesh Katkar | 2022-06-28 |
| 11369020 | Stacked transmission line | Shaowu Huang, Javier A. Delacruz | 2022-06-21 |
| 11348898 | Systems and methods for releveled bump planes for chiplets | Javier A. Delacruz, Cyprian Emeka Uzoh, Rajesh Katkar, Ilyas Mohammed | 2022-05-31 |
| 11296053 | Direct bonded stack structures for increased reliability and improved yield in microelectronics | Cyprian Emeka Uzoh, Rajesh Katkar, Thomas Workman, Guilian Gao, Gaius Gillman Fountain, Jr. +3 more | 2022-04-05 |
| 11276676 | Stacked devices and methods of fabrication | Paul M. Enquist | 2022-03-15 |
| 11270979 | Symbiotic network on layers | Javier A. Delacruz, Rajesh Katkar | 2022-03-08 |
| 11264361 | Network on layer enabled architectures | Javier A. Delacruz | 2022-03-01 |
| 11264357 | Mixed exposure for large die | Javier A. Delacruz | 2022-03-01 |
| 11256004 | Direct-bonded lamination for improved image clarity in optical devices | Rajesh Katkar, Ilyas Mohammed | 2022-02-22 |
| 11246230 | Configurable smart object system with methods of making modules and contactors | Ilyas Mohammed, Gabriel Z. Guevara, Min Tao | 2022-02-08 |
| 11239587 | Configurable smart object system with clip-based connectors | Ilyas Mohammed, Gabriel Z. Guevara, Min Tao | 2022-02-01 |
| 11171117 | Interlayer connection of stacked microelectronic components | Guilian Gao | 2021-11-09 |
| 11158606 | Molded direct bonded and interconnected stack | Guilian Gao, Cyprian Emeka Uzoh, Jeremy Alfred Theil, Rajesh Katkar | 2021-10-26 |
| 11063017 | Embedded organic interposer for high bandwidth | Javier A. Delacruz | 2021-07-13 |
| 11024220 | Formation of a light-emitting diode display | Liang Wang, Rajesh Katkar, Javier A. Delacruz, Ilyas Mohammed | 2021-06-01 |
| 11004930 | High density three-dimensional integrated capacitors | Vage Oganesian, Ilyas Mohammed, Piyush Savalia | 2021-05-11 |
| 10991676 | Systems and methods for flash stacking | Ilyas Mohammed, Javier A. Delacruz | 2021-04-27 |