Issued Patents All Time
Showing 26–50 of 636 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12199011 | Embedded liquid cooling | Gaius Gillman Fountain, Jr. | 2025-01-14 |
| 12191267 | Nanowire bonding interconnect for fine-pitch microelectronics | Ilyas Mohammed | 2025-01-07 |
| 12191233 | Embedded cooling systems and methods of manufacturing embedded cooling systems | Thomas Workman, Cyprian Emeka Uzoh, Guilian Gao, Rajesh Katkar | 2025-01-07 |
| 12191234 | Integrated cooling assemblies for advanced device packaging and methods of manufacturing the same | Gaius Gillman Fountain, Jr., Kyong-Mo Bang | 2025-01-07 |
| 12191235 | Integrated cooling assemblies including signal redistribution and methods of manufacturing the same | Rajesh Katkar | 2025-01-07 |
| 12183659 | Embedded cooling assemblies for advanced device packaging and methods of manufacturing the same | — | 2024-12-31 |
| 12176263 | Integrated cooling assembly including coolant channel on the backside semiconductor device | Cyprian Emeka Uzoh, Rajesh Katkar | 2024-12-24 |
| 12174246 | Security circuitry for bonded structures | Javier A. Delacruz, Guy Regev | 2024-12-24 |
| 12176264 | Manifold designs for embedded liquid cooling in a package | Gaius Gillman Fountain, Jr., Laura Wills Mirkarimi, Ron Zhang, Rajesh Katkar | 2024-12-24 |
| 12176294 | Bonded structure with interconnect structure | — | 2024-12-24 |
| 12154858 | Connecting multiple chips using an interconnect device | Javier A. Delacruz | 2024-11-26 |
| 12153222 | Bonded optical devices | Rajesh Katkar | 2024-11-26 |
| 12124035 | Stretchable film assembly with conductive traces | Ilyas Mohammed, Gabriel Z. Guevara, Min Tao | 2024-10-22 |
| 12080672 | Direct gang bonding methods including directly bonding first element to second element to form bonded structure without adhesive | Laura Wills Mirkarimi, Javier A. Delacruz, Rajesh Katkar, Cyprian Emeka Uzoh, Guilian Gao +1 more | 2024-09-03 |
| 12057383 | Bonded structures with integrated passive component | Ilyas Mohammed, Rajesh Katkar, Gabriel Z. Guevara, Javier A. Delacruz, Shaowu Huang +1 more | 2024-08-06 |
| 12046583 | Electrical redundancy for bonded structures | Rajesh Katkar | 2024-07-23 |
| 12046569 | Integrated device packages with integrated device die and dummy element | — | 2024-07-23 |
| 12046482 | Microelectronic assemblies | — | 2024-07-23 |
| 12035529 | 3D NAND—high aspect ratio strings and channels | Rajesh Katkar, Xu Chang | 2024-07-09 |
| 11955463 | Direct bonded stack structures for increased reliability and improved yield in microelectronics | Cyprian Emeka Uzoh, Rajesh Katkar, Thomas Workman, Guilian Gao, Gaius Gillman Fountain, Jr. +3 more | 2024-04-09 |
| 11955445 | Metal pads over TSV | Guilian Gao, Bongsub Lee, Gaius Gillman Fountain, Jr., Cyprian Emeka Uzoh, Laura Wills Mirkarimi +1 more | 2024-04-09 |
| 11929347 | Mixed exposure for large die | Javier A. Delacruz | 2024-03-12 |
| 11914148 | Stacked optical waveguides | Ilyas Mohammed, Rajesh Katkar | 2024-02-27 |
| 11916054 | Stacked devices and methods of fabrication | Paul M. Enquist | 2024-02-27 |
| 11901281 | Bonded structures with integrated passive component | Javier A. Delacruz | 2024-02-13 |