Issued Patents All Time
Showing 76–100 of 108 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9466488 | Metal-semiconductor contact structure with doped interlayer | Yu-Hung Lin, Sheng-Hsuan Lin, Chih-Wei Chang | 2016-10-11 |
| 9460949 | Ultra-low oxygen and humility loadport and stocker system | Chih-Wei Huang, Kuo-Sheng Chuang | 2016-10-04 |
| 9455169 | Ultra-low oxygen and humility loadport and stocker system | Chih-Wei Huang, Yii-Cheng Lin | 2016-09-27 |
| 9412850 | Method of trimming fin structure | Kuo-Sheng Chuang | 2016-08-09 |
| 9397040 | Semiconductor device comprising metal plug having substantially convex bottom surface | Yu-Hung Lin, Sheng-Hsuan Lin, Chih-Wei Chang | 2016-07-19 |
| 9385080 | Interconnect structure and method of forming the same | Yu-Hung Lin, Mei-Hui Fu, Wei-Jung Lin, Chia-Lin Hsu, Hon-Lin Huang +1 more | 2016-07-05 |
| 9287154 | UV curing system for semiconductors | Ming Huei Lien, Chia-Ho Chen, Shu-Fen Wu, Chih-Tsung Lee | 2016-03-15 |
| 9272315 | Mechanisms for controlling gas flow in enclosure | Kuo-Sheng Chuang, Yii-Cheng Lin | 2016-03-01 |
| 9234278 | CVD conformal vacuum/pumping guiding design | Chih-Tsung Lee, Chia-Ho Chen, Chin-Hsiang Lin | 2016-01-12 |
| 9218998 | Electrostatic chuck with multi-zone control | Chia-Ho Chen, Ming Huei Lien, Shu-Fen Wu, Chih-Tsung Lee | 2015-12-22 |
| 9190347 | Die edge contacts for semiconductor devices | Yi-Jen Lai, Hon-Lin Huang, Huai-Tei Yang | 2015-11-17 |
| 9093252 | Rotation plus vibration magnet for magnetron sputtering apparatus | Bo-Hung Lin, Ming-Chih Tsai, Chung-En Kao | 2015-07-28 |
| 9026241 | Closed loop control for reliability | Wen-Cheng Yang, Chung-En Kao, Ming-Chih Tsai, Chen-Chia Chiang, Bo-Hung Lin +1 more | 2015-05-05 |
| 9006070 | Two-step shallow trench isolation (STI) process | Min Hao Hong, Chih-Tsung Lee, Shiu-Ko JangJian, Miao-Cheng Liao, Hsiang Hsiang Ko +1 more | 2015-04-14 |
| 8953298 | Electrostatic chuck robotic system | Chung-En Kao, Chih-Tsung Lee, Ming-Shiou Kuo | 2015-02-10 |
| 8941232 | Metal bumps for cooling device connection | Yi-Jen Lai, Chun-Jen Chen, Perre Kao | 2015-01-27 |
| 8926806 | Shielding design for metal gap fill | Ming-Chin Tsai, Bo-Hung Lin, Chung-En Kao | 2015-01-06 |
| 8916480 | Chemical vapor deposition film profile uniformity control | Ming-Shiou Kuo, Chih-Tsung Lee, Ming-Chin Tsai, Chia-Ho Chen, Chin-Hsiang Lin | 2014-12-23 |
| 8902561 | Electrostatic chuck with multi-zone control | Chia-Ho Chen, Ming Huei Lien, Shu-Fen Wu, Chih-Tsung Lee | 2014-12-02 |
| 8796105 | Method and apparatus for preparing polysilazane on a semiconductor wafer | Chih-Tsung Lee, Min Hao Hong, Ming Huei Lien, Chih-Jen Wu, Chen-Ming Huang | 2014-08-05 |
| 8742776 | Mechanisms for resistivity measurement of bump structures | Mill-Jer Wang, Pi-Huang Lee, Jeff Wang, Feynmann Chu | 2014-06-03 |
| 8709528 | Wafer processing method and system using multi-zone chuck | Nai-Han Cheng, Chi-Ming Yang, Kuo-Sheng Chuang, Chin-Hsiang Lin | 2014-04-29 |
| 8692299 | Two-step shallow trench isolation (STI) process | Min Hao Hong, Chih-Tsung Lee, Shiu-Ko JangJian, Miao-Cheng Liao, Hsiang Hsiang Ko +1 more | 2014-04-08 |
| 8624394 | Integrated technology for partial air gap low K deposition | Hung Jui Chang, Chih-Tsung Lee, Shiu-Ko Jang Jian, Ming-Shiou Kuo | 2014-01-07 |
| 8564319 | Probe card for simultaneously testing multiple dies | Yi-Jen Lai | 2013-10-22 |