Issued Patents All Time
Showing 26–36 of 36 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6664177 | Dielectric ARC scheme to improve photo window in dual damascene process | Kwang-Ming Lin, Chung-Hung Lu, Ya-Li Tai, Kun Liu | 2003-12-16 |
| 6602560 | Method for removing residual fluorine in HDP-CVD chamber | Yi-Lung Cheng, Wen-Kung Cheng, Ming-Hwa Yoo, Ying-Long Wang, Pei-Fen Chou | 2003-08-05 |
| 6586347 | Method and structure to improve the reliability of multilayer structures of FSG (F-doped SiO2) dielectric layers and metal layers in semiconductor integrated circuits | Chung-Shi Liu, Hui Wang, Chun-Ching Tsan, Ying-Lang Wang, Tong-Hua Kuan | 2003-07-01 |
| 6585826 | Semiconductor wafer cleaning method to remove residual contamination including metal nitride particles | Yali Tai, Shih-Chi Lin, Wen-Long Lee, Francis Wang, Hsi-Kuei Cheng +1 more | 2003-07-01 |
| 6573189 | Manufacture method of metal bottom ARC | Shih-Chi Lin, Ming-Hua Yu | 2003-06-03 |
| 6479098 | Method to solve particle performance of FSG layer by using UFU season film for FSG process | Ming-Hwa Yoo, Yi-Lung Cheng, Ying-Lang Wang | 2002-11-12 |
| 6436791 | Method of manufacturing a very deep STI (shallow trench isolation) | Shih-Chi Lin, Ying-Lang Wang, Guey Bao Huang | 2002-08-20 |
| 6358761 | Silicon monitor for detection of H2O2 in acid bath | Hui-Ju Yoo, Cheng-Kun Lin, Shiow-Jye Jenq | 2002-03-19 |
| 6281146 | Plasma enhanced chemical vapor deposition (PECVD) method for forming microelectronic layer with enhanced film thickness uniformity | Ying-Lang Wang, Hui Wang, Jowei Dun | 2001-08-28 |
| 6136680 | Methods to improve copper-fluorinated silica glass interconnects | Jane-Bai Lai, Chung-Shi Liu, Tien-I Bao, Syun-Ming Jang, Chung-Long Chang +4 more | 2000-10-24 |
| 6060374 | Monitor for molecular nitrogen during silicon implant | Cheng-Kun Lin | 2000-05-09 |