Issued Patents All Time
Showing 26–50 of 91 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11587886 | Semiconductor device | Kuan-Yu Huang, Pai Yuan Li, Shu-Chia Hsu, Hsiang-Fan Lee, Szu-Po Huang | 2023-02-21 |
| 11569156 | Semiconductor device, electronic device including the same, and manufacturing method thereof | Kuan-Yu Huang, Shang-Yun Hou | 2023-01-31 |
| 11502015 | Semiconductor package and manufacturing method thereof | Wen-Wei Shen, Shang-Yun Hou, Kuan-Yu Huang | 2022-11-15 |
| 11502056 | Joint structure in semiconductor package and manufacturing method thereof | Kuan-Yu Huang, Chih-Wei Wu, Shang-Yun Hou, Ying-Ching Shih, Cheng-Chieh Li | 2022-11-15 |
| 11493689 | Photonic semiconductor device and method of manufacture | Chen-Hua Yu, Hsing-Kuo Hsia, Kuo-Chiang Ting, Shang-Yun Hou, Chi-Hsi Wu | 2022-11-08 |
| 11454773 | Optical transceiver and manufacturing method thereof | Chen-Hua Yu, Hsing-Kuo Hsia, Kuan-Yu Huang, Kuo-Chiang Ting, Shang-Yun Hou +1 more | 2022-09-27 |
| 11450580 | Semiconductor structure and method of fabricating the same | Kuan-Yu Huang, Shang-Yun Hou, Chien-Yuan Huang | 2022-09-20 |
| 11437334 | Chip package structure | Kuan-Yu Huang, Shang-Yun Hou | 2022-09-06 |
| 11428879 | Method for forming a package structure for optical fiber | Jui Hsieh Lai, Shang-Yun Hou | 2022-08-30 |
| 11424219 | Package structure and method of fabricating the same | Wen-Wei Shen, Shang-Yun Hou | 2022-08-23 |
| 11328936 | Structure and formation method of package structure with underfill | Kuan-Yu Huang, Jui Hsieh Lai, Shang-Yun Hou | 2022-05-10 |
| 11270956 | Package structure and fabricating method thereof | Kuan-Yu Huang, Shang-Yun Hou | 2022-03-08 |
| 11222867 | Package and manufacturing method thereof | Shang-Yun Hou, Kuan-Yu Huang | 2022-01-11 |
| 11201097 | Method of manufacture of a semiconductor device | Kuan-Yu Huang, Chih-Wei Wu, Li-Chung Kuo, Long Hua Lee, Ying-Ching Shih +1 more | 2021-12-14 |
| 11156772 | Photonic semiconductor device and method | Chen-Hua Yu, Hsing-Kuo Hsia, Kuo-Chiang Ting, Pin-Tso Lin, Shang-Yun Hou +1 more | 2021-10-26 |
| 11150404 | Photonic package and method forming same | Jui Hsieh Lai, Tien-Yu Huang, Wen-Cheng Chen, Yushun Lin | 2021-10-19 |
| 11121050 | Method of manufacture of a semiconductor device | Kuan-Yu Huang, Chih-Wei Wu, Li-Chung Kuo, Long Hua Lee, Ying-Ching Shih +1 more | 2021-09-14 |
| 11101236 | Semiconductor package and method of forming the same | Kuan-Yu Huang, Li-Chung Kuo, Shang-Yun Hou, Tsung-Yu Chen, Chien-Yuan Huang | 2021-08-24 |
| 11101260 | Method of forming a dummy die of an integrated circuit having an embedded annular structure | Shang-Yun Hou, Kuan-Yu Huang, Hsien-Pin Hu, Yushun Lin, Heh-Chang Huang +8 more | 2021-08-24 |
| 10985125 | Chip package structure | Kuan-Yu Huang, Shu-Chia Hsu, Leu-Jen Chen, Yi-Wei Liu, Shang-Yun Hou +4 more | 2021-04-20 |
| 10978346 | Conductive vias in semiconductor packages and methods of forming same | Hung-Pin Chang, Sao-Ling Chiu, Shang-Yun Hou, Wan-Yu Lee | 2021-04-13 |
| 10948668 | Package structure for optical fiber and method for forming the same | Jui Hsieh Lai, Shang-Yun Hou | 2021-03-16 |
| 10886147 | Package structure and method for forming the same | Kuan-Yu Huang, Shang-Yun Hou | 2021-01-05 |
| 10872871 | Chip package structure with dummy bump and method for forming the same | Kuan-Yu Huang, Shang-Yun Hou, Yushun Lin, Heh-Chang Huang, Shu-Chia Hsu +2 more | 2020-12-22 |
| 10866373 | Optical transceiver and manufacturing method thereof | Chen-Hua Yu, Hsing-Kuo Hsia, Kuan-Yu Huang, Kuo-Chiang Ting, Shang-Yun Hou +1 more | 2020-12-15 |