Issued Patents All Time
Showing 51–75 of 91 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10867951 | Semiconductor device | Kuan-Yu Huang, Tzu-Kai Lan, Shou-Chih Yin, Shu-Chia Hsu, Pai Yuan Li +2 more | 2020-12-15 |
| 10847485 | Chip package structure and method for forming the same | Kuan-Yu Huang, Shang-Yun Hou | 2020-11-24 |
| 10790254 | Chip package structure | Kuan-Yu Huang, Shu-Chia Hsu, Leu-Jen Chen, Yi-Wei Liu, Shang-Yun Hou +4 more | 2020-09-29 |
| 10770405 | Thermal interface material having different thicknesses in packages | Da-Cyuan Yu, Kuan-Yu Huang, Pai Yuan Li, Hsiang-Fan Lee | 2020-09-08 |
| 10746923 | Photonic semiconductor device and method | Chen-Hua Yu, Hsing-Kuo Hsia, Kuo-Chiang Ting, Pin-Tso Lin, Shang-Yun Hou +1 more | 2020-08-18 |
| 10707177 | Thermal interface material having different thicknesses in packages | Da-Cyuan Yu, Kuan-Yu Huang, Pai Yuan Li, Hsiang-Fan Lee | 2020-07-07 |
| 10656351 | Package structure for optical fiber and method for forming the same | Jui Hsieh Lai, Shang-Yun Hou | 2020-05-19 |
| 10629545 | Semiconductor device | Kuan-Yu Huang, Pai Yuan Li, Shu-Chia Hsu, Hsiang-Fan Lee, Szu-Po Huang | 2020-04-21 |
| 10510603 | Conductive vias in semiconductor packages and methods of forming same | Hung-Pin Chang, Sao-Ling Chiu, Shang-Yun Hou, Wan-Yu Lee | 2019-12-17 |
| 10459159 | Photonic package and method forming same | Jui Hsieh Lai, Tien-Yu Huang, Wen-Cheng Chen, Yushun Lin | 2019-10-29 |
| 10340242 | Semiconductor device and method of manufacturing the same | Kuan-Yu Huang, Tzu-Kai Lan, Shou-Chih Yin, Shu-Chia Hsu, Pai Yuan Li +2 more | 2019-07-02 |
| 10276532 | Three-dimensional chip stack and method of forming the same | Wei-Ming Chen, Cheng-Hsien Hsieh, Kuo-Ching Hsu | 2019-04-30 |
| 10267988 | Photonic package and method forming same | Jui Hsieh Lai, Tien-Yu Huang, Wen-Cheng Chen, Yushun Lin | 2019-04-23 |
| 9698115 | Three-dimensional chip stack and method of forming the same | Wei-Ming Chen, Cheng-Hsien Hsieh, Kuo-Ching Hsu | 2017-07-04 |
| 9355980 | Three-dimensional chip stack and method of forming the same | Wei-Ming Chen, Cheng-Hsien Hsieh, Kuo-Ching Hsu | 2016-05-31 |
| 9182641 | Signal line structure of a flat display | Wei-Chou Lan, Chia-Chun Yeh, Ted-Hong Shinn | 2015-11-10 |
| 9081249 | Electrophoresis display apparatus | Ming-Chuan Hung, Po-Wen Hsiao, Tsung-Yi Lin, Wei-Chun Hsu | 2015-07-14 |
| 8895385 | Methods of forming semiconductor structures | Chun Hua Chang, Der-Chyang Yeh | 2014-11-25 |
| 8890224 | Semiconductor structures having a metal-insulator-metal capacitor structure | Chun Hua Chang, Der-Chyang Yeh | 2014-11-18 |
| 8835913 | Transistor structure | Chia-Chun Yeh, Henry Wang, Yao-Chou Tsai | 2014-09-16 |
| 8791909 | Display panel | Yao-Chou Tsai, Po-Wen Hsiao, Ted-Hong Shinn | 2014-07-29 |
| 8780146 | Driving member and driving member array module | Wei-Chou Lan, San-Long Lin | 2014-07-15 |
| 8723843 | Pixel driving circuit with capacitor having threshold voltages information storing function, pixel driving method and light emitting display device | Ted-Hong Shinn, Wei-Chou Lan, Chin-Wen Lin | 2014-05-13 |
| 8655197 | Electronic paper structure and method for fabricating electronic paper | Chuan-I HUANG, Chin-Wen Lin, Ted-Hong Shinn | 2014-02-18 |
| 8643005 | Organic light emitting display device and method for manufacturing the same | Wei-Chou Lan, Chia-Chun Yeh, Ted-Hong Shinn | 2014-02-04 |