Issued Patents All Time
Showing 26–50 of 52 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10847413 | Method of forming contact plugs for semiconductor device | Mrunal A. Khaderbad, Yasutoshi Okuno, Sung-Li Wang, Pang-Yen Tsai, Teng-Chun Tsai | 2020-11-24 |
| 10847410 | Ruthenium-containing semiconductor structure and method of manufacturing the same | Teng-Chun Tsai, Chen-Hao Wu, Chu-An Lee, Chun-Hung Liao, Tsung-Ling Tsai | 2020-11-24 |
| 10774241 | CMP slurry solution for hardened fluid material | Kuo-Yin Lin, Wen-Kuei Liu, Teng-Chun Tsai, Kuo-Cheng Lien, Chang-Sheng Lin +1 more | 2020-09-15 |
| 10727076 | Slurry and manufacturing semiconductor using the slurry | Chun-Hung Liao, Chung-Wei Hsu, Tsung-Ling Tsai, Chen-Hao Wu, Chu-An Lee +2 more | 2020-07-28 |
| 10510555 | Mechanism for manufacturing semiconductor device | Chen-Hao Wu, Chung-Wei Hsu, Tsung-Ling Tsai, Teng-Chun Tsai | 2019-12-17 |
| 10497574 | Method for forming multi-layer mask | Chung-Wei Hsu, Yu-Chung Su, Chen-Hao Wu, Tsung-Ling Tsai, Teng-Chun Tsai | 2019-12-03 |
| 10461080 | Method for manufacturing a FinFET device | Kuo-Yin Lin, Pin-Chuan Su, Teng-Chun Tsai | 2019-10-29 |
| 10269579 | Method of manufacturing semiconductor device | Teng-Chun Tsai, Chung-Wei Hsu, Chen-Hao Wu, Tsung-Ling Tsai | 2019-04-23 |
| 10160091 | CMP polishing head design for improving removal rate uniformity | Te-Chien Hou, Ching-Hong Jiang, Kuo-Yin Lin, Ming-Shiuan She, Teng-Chun Tsai +1 more | 2018-12-25 |
| 10144109 | Polisher, polishing tool, and polishing method | Teng-Chun Tsai, Yung-Cheng Lu, Chia-Chiung Lo, Shwang-Ming Jeng, Yee-Chia Yeo | 2018-12-04 |
| 9962801 | Systems and methods for performing chemical mechanical planarization | Teng-Chun Tsai, Yung-Cheng Lu | 2018-05-08 |
| 9852899 | Wafer back-side polishing system and method for integrated circuit device manufacturing processes | Teng-Chun Tsai, Hsin-Hsien Lu, Chang-Sheng Lin, Kuo-Cheng Lien, Kuo-Yin Lin +2 more | 2017-12-26 |
| 9748109 | CMP-friendly coatings for planar recessing or removing of variable-height layers | Wen-Kuei Liu, Teng-Chun Tsai, Kuo-Yin Lin, Yu-Wei Chou, Kuo-Cheng Lien +3 more | 2017-08-29 |
| 9567493 | CMP slurry solution for hardened fluid material | Kuo-Yin Lin, Wen-Kuei Liu, Teng-Chun Tsai, Kuo-Cheng Lien, Chang-Sheng Lin +1 more | 2017-02-14 |
| 9559021 | Wafer back-side polishing system and method for integrated circuit device manufacturing processes | Teng-Chun Tsai, Hsin-Hsien Lu, Chang-Sheng Lin, Kuo-Cheng Lien, Kuo-Yin Lin +2 more | 2017-01-31 |
| 9478431 | BARC-assisted process for planar recessing or removing of variable-height layers | Wen-Kuei Liu, Teng-Chun Tsai, Kuo-Yin Lin, Yu-Wei Chou, Kuo-Cheng Lien +3 more | 2016-10-25 |
| 9287127 | Wafer back-side polishing system and method for integrated circuit device manufacturing processes | Teng-Chun Tsai, Hsin-Hsien Lu, Chang-Sheng Lin, Kuo-Cheng Lien, Kuo-Yin Lin +2 more | 2016-03-15 |
| 9236446 | Barc-assisted process for planar recessing or removing of variable-height layers | Wen-Kuei Liu, Teng-Chun Tsai, Kuo-Yin Lin, Yu-Wei Chou, Kuo-Cheng Lien +3 more | 2016-01-12 |
| 9132523 | Chemical mechanical polish process control for improvement in within-wafer thickness uniformity | Ying-Mei Lin, Yu-Jen Cheng, Keung Hui, Huan-Just Lin | 2015-09-15 |
| 8153526 | High planarizing method for use in a gate last process | Huan-Just Lin, Shih-Chang Chen | 2012-04-10 |
| 8129279 | Chemical mechanical polish process control for improvement in within-wafer thickness uniformity | Ying-Mei Lin, Yu-Jen Cheng, Keung Hui, Huan-Just Lin | 2012-03-06 |
| 7407601 | Polymeric particle slurry system and method to reduce feature sidewall erosion | Ying-Ho Chen, Syun-Ming Jang, Tzu-Jen Chou | 2008-08-05 |
| 6924238 | Edge peeling improvement of low-k dielectric materials stack by adjusting EBR resistance | Tzu-Jen Chou, Syun-Ming Jang, Ying-Ho Chen | 2005-08-02 |
| 6919276 | Method to reduce dishing and erosion in a CMP process | Ying-Ho Chen, Syun-Ming Jang, Tzu-Jen Chou, Jin-Yiing Song | 2005-07-19 |
| 6812135 | Adhesion enhancement between CVD dielectric and spin-on low-k silicate films | Lain-Jong Li | 2004-11-02 |