Issued Patents All Time
Showing 101–125 of 136 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9818644 | Interconnect structure and manufacturing method thereof | Shin-Yi Yang, Hsi-Wen Tien, Hsiang-Huan Lee, Shau-Lin Shue | 2017-11-14 |
| 9728503 | Via pre-fill on back-end-of-the-line interconnect layer | Chao-Hsien Peng, Chi-Liang Kuo, Hsiang-Huan Lee, Shau-Lin Shue | 2017-08-08 |
| 9728485 | Semiconductor device with interconnect structure having catalys layer | Shau-Lin Shue | 2017-08-08 |
| 9721887 | Method of forming metal interconnection | Chao-Hsien Peng, Chih Wei Lu, Shau-Lin Shue | 2017-08-01 |
| 9721894 | Semiconductor device and manufacturing method thereof | Shih-Kang Fu, Hsien-Chang Wu, Li-Lin Su, Shau-Lin Shue | 2017-08-01 |
| 9640431 | Method for via plating with seed layer | Shin-Yi Yang, Ching-Fu Yeh, Tz-Jun Kuo, Hsiang-Huan Lee | 2017-05-02 |
| 9613854 | Method and apparatus for back end of line semiconductor device processing | Shin-Yi Yang, Hsiang-Huan Lee, Ching-Fu Yeh, Pei-Yin Liou | 2017-04-04 |
| 9613856 | Method of forming metal interconnection | Shin-Yi Yang, Shau-Lin Shue, Tz-Jun Kuo | 2017-04-04 |
| 9548241 | Semiconductor device metallization systems and methods | Hsiang-Huan Lee, Shau-Lin Shue, Keith Kuang-Kuo Koai, Hai-Ching Chen, Tung-Ching Tseng +3 more | 2017-01-17 |
| 9530737 | Semiconductor device and manufacturing method thereof | Shih-Kang Fu, Hsien-Chang Wu, Li-Lin Su, Shau-Lin Shue | 2016-12-27 |
| 9496170 | Interconnect having air gaps and polymer wrapped conductive lines | Shin-Yi Yang, Hsiang-Huan Lee, Hsi-Wen Tien, Shau-Lin Shue | 2016-11-15 |
| 9490205 | Integrated circuit interconnects and methods of making same | Cheng-Hsiung Tsai, Chung-Ju Lee, Tsung-Jung Tsai, Hsiang-Huan Lee | 2016-11-08 |
| 9484302 | Semiconductor devices and methods of manufacture thereof | Shin-Yi Yang, Hsiang-Huan Lee, Hsien-Chang Wu | 2016-11-01 |
| 9324608 | Method for via plating with seed layer | Shin-Yi Yang, Ching-Fu Yeh, Tz-Jun Kuo, Hsiang-Huan Lee | 2016-04-26 |
| 9318364 | Semiconductor device metallization systems and methods | Hsiang-Huan Lee, Shau-Lin Shue, Keith Kuang-Kuo Koai, Hai-Ching Chen, Tung-Ching Tseng +3 more | 2016-04-19 |
| 9318439 | Interconnect structure and manufacturing method thereof | Shin-Yi Yang, Hsi-Wen Tien, Hsiang-Huan Lee, Shau-Lin Shue | 2016-04-19 |
| 9281263 | Interconnect structure including a continuous conductive body | Hai-Ching Chen, Hsiang-Huan Lee, Tien-I Bao, Chi-Lin Teng | 2016-03-08 |
| 9269668 | Interconnect having air gaps and polymer wrapped conductive lines | Shin-Yi Yang, Hsiang-Huan Lee, Hsi-Wen Tien, Shau-Lin Shue | 2016-02-23 |
| 9219033 | Via pre-fill on back-end-of-the-line interconnect layer | Chao-Hsien Peng, Chi-Liang Kuo, Hsiang-Huan Lee, Shau-Lin Shue | 2015-12-22 |
| 9142505 | Method and apparatus for back end of line semiconductor device processing | Shin-Yi Yang, Hsiang-Huan Lee, Ching-Fu Yeh, Pei-Yin Liou | 2015-09-22 |
| 9054163 | Method for via plating with seed layer | Shin-Yi Yang, Ching-Fu Yeh, Tz-Jun Kuo, Hsiang-Huan Lee | 2015-06-09 |
| 9034756 | Integrated circuit interconnects and methods of making same | Cheng-Hsiung Tsai, Chung-Ju Lee, Tsung-Jung Tsai, Hsiang-Huan Lee | 2015-05-19 |
| 9006095 | Semiconductor devices and methods of manufacture thereof | Shin-Yi Yang, Hsiang-Huan Lee, Hsien-Chang Wu | 2015-04-14 |
| 8749060 | Method of semiconductor integrated circuit fabrication | Tz-Jun Kuo, Chien-Hsin Ho, Hsiang-Huan Lee | 2014-06-10 |
| 8735278 | Copper etch scheme for copper interconnect structure | Hai-Ching Chen, Hsiang-Huan Lee, Tien-I Bao, Chi-Lin Teng | 2014-05-27 |