Issued Patents All Time
Showing 76–100 of 136 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11094631 | Graphene layer for reduced contact resistance | Shin-Yi Yang, Shau-Lin Shue | 2021-08-17 |
| 11094626 | Methods of forming interconnect structures in semiconductor fabrication | Shau-Lin Shue | 2021-08-17 |
| 11081447 | Graphene-assisted low-resistance interconnect structures and methods of formation thereof | Shin-Yi Yang, Yu-Chen Chan, Hai-Ching Chen, Shau-Lin Shue | 2021-08-03 |
| 11011467 | Method of forming interconnection structure | Yu-Chen Chan, Shin-Yi Yang | 2021-05-18 |
| 10964636 | Interconnect structure with low resistivity and method for forming the same | Shin-Yi Yang | 2021-03-30 |
| 10879115 | Semiconductor device and forming method thereof | Shih-Kang Fu, Meng-Pei Lu, Shau-Lin Shue | 2020-12-29 |
| 10763211 | Semiconductor device and manufacturing method thereof | Shau-Lin Shue | 2020-09-01 |
| 10741493 | Interconnection structure and method for forming the same | Yu-Chen Chan, Shin-Yi Yang | 2020-08-11 |
| 10714424 | Method of forming metal interconnection | Shin-Yi Yang, Shau-Lin Shue, Tz-Jun Kuo | 2020-07-14 |
| 10651279 | Semiconductor interconnect structure having graphene-capped metal interconnects | Shin-Yi Yang, Ching-Fu Yeh, Shau-Lin Shue | 2020-05-12 |
| 10535559 | Semiconductor interconnect structure having a graphene barrier layer | Shin-Yi Yang, Shau-Lin Shue | 2020-01-14 |
| 10510657 | Semiconductor device with interconnecting structure and method for manufacturing the same | Shin-Yi Yang, Shau-Lin Shue | 2019-12-17 |
| 10453740 | Interconnect structure without barrier layer on bottom surface of via | Tz-Jun Kuo, Chien-Hsin Ho | 2019-10-22 |
| 10319632 | Semiconductor interconnect structure having a graphene barrier layer | Shin-Yi Yang, Shau-Lin Shue | 2019-06-11 |
| 10269706 | Semiconductor device and manufacturing method thereof | Shau-Lin Shue | 2019-04-23 |
| 10163786 | Method of forming metal interconnection | Shin-Yi Yang, Shau-Lin Shue, Tz-Jun Kuo | 2018-12-25 |
| 10163698 | Interconnect structure and manufacturing method thereof | Ching-Fu Yeh | 2018-12-25 |
| 10163700 | Method for forming conductive structure using polishing process | Shih-Kang Fu | 2018-12-25 |
| 10163753 | Method for forming interconnect structure of semiconductor device | Shau-Lin Shue | 2018-12-25 |
| 10164018 | Semiconductor interconnect structure having graphene-capped metal interconnects | Shin-Yi Yang, Ching-Fu Yeh, Shau-Lin Shue | 2018-12-25 |
| 10141260 | Interconnection structure and method for forming the same | Yu-Chen Chan, Shin-Yi Yang | 2018-11-27 |
| 10121698 | Method of manufacturing a semiconductor device | Hsiang-Huan Lee, Shau-Lin Shue, Kuang-Kuo Koai, Hai-Ching Chen, Tung-Ching Tseng +3 more | 2018-11-06 |
| 9972529 | Method of forming metal interconnection | Shin-Yi Yang, Shau-Lin Shue, Tz-Jun Kuo | 2018-05-15 |
| 9898983 | Source driving device with 3 types of gate oxide layer | Yu-Hao Hsu, Jui-Chang Lin, Wei-Cheng Lin | 2018-02-20 |
| 9842767 | Method of forming an interconnection | Tz-Jun Kuo, Chien-Hsin Ho, Hsiang-Huan Lee | 2017-12-12 |