Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12308282 | Interconnect structure without barrier layer on bottom surface of via | Tz-Jun Kuo, Ming-Han Lee | 2025-05-20 |
| 11322391 | Interconnect structure without barrier layer on bottom surface of via | Tz-Jun Kuo, Ming-Han Lee | 2022-05-03 |
| 10453740 | Interconnect structure without barrier layer on bottom surface of via | Tz-Jun Kuo, Ming-Han Lee | 2019-10-22 |
| 9842767 | Method of forming an interconnection | Ming-Han Lee, Tz-Jun Kuo, Hsiang-Huan Lee | 2017-12-12 |
| 8749060 | Method of semiconductor integrated circuit fabrication | Ming-Han Lee, Tz-Jun Kuo, Hsiang-Huan Lee | 2014-06-10 |