Issued Patents All Time
Showing 26–50 of 525 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12142569 | Integrated chip for standard logic performance improvement having a back-side through-substrate-via and method for forming the integrated chip | Min-Feng Kao, Jen-Cheng Liu, Hsun-Ying Huang | 2024-11-12 |
| 12068287 | Stacked semiconductor structure and method | Szu-Ying Chen, Meng-Hsun Wan | 2024-08-20 |
| 12062679 | Backside structure for image sensor | Min-Feng Kao, Jen-Cheng Liu, Wen-Chang Kuo, Shih-Han Huang | 2024-08-13 |
| 12057446 | Stacked semiconductor device and method | Min-Feng Kao, Jen-Cheng Liu, Hsing-Chih Lin | 2024-08-06 |
| 12040336 | Semiconductor imaging device having improved dark current performance | Seiji Takahashi, Chen-Jong Wang, Feng-Chi Hung, Feng-Jia Shiu, Jen-Cheng Liu +5 more | 2024-07-16 |
| 12034037 | Backside capacitor techniques | Min-Feng Kao, Hsing-Chih Lin, Jen-Cheng Liu | 2024-07-09 |
| 12033919 | Backside or frontside through substrate via (TSV) landing on metal | Zheng-Xun Li, Min-Feng Kao, Hsing-Chih Lin, Jen-Cheng Liu | 2024-07-09 |
| 12009214 | Gate electrodes with notches and methods for forming the same | Min-Feng Kao, Szu-Ying Chen, Jen-Cheng Liu, Tzu-Hsuan Hsu, Feng-Chi Hung | 2024-06-11 |
| 11996433 | Pad structure for front side illuminated image sensor | Kai-Chun Hsu, Ching-Chun Wang, Jeng-Shyan Lin, Shyh-Fann Ting | 2024-05-28 |
| 11996399 | Hybrid bonding with uniform pattern density | Szu-Ying Chen | 2024-05-28 |
| 11984465 | Multiple deep trench isolation (MDTI) structure for CMOS image sensor | Wei Chuang Wu, Ching-Chun Wang, Feng-Chi Hung, Jen-Cheng Liu, Yen-Ting Chiang +2 more | 2024-05-14 |
| 11978758 | Methods and apparatus for via last through-vias | Szu-Ying Chen, Pao-Tung Chen, Jen-Cheng Liu | 2024-05-07 |
| 11973101 | Mechanisms for forming image-sensor device with deep-trench isolation structure | Jeng-Shyan Lin, Jen-Cheng Liu, Feng-Chi Hung | 2024-04-30 |
| 11955428 | Semiconductor structure and manufacturing method thereof | Hsin-Hung Chen, Min-Feng Kao, Hsing-Chih Lin, Jen-Cheng Liu | 2024-04-09 |
| 11942368 | Through silicon vias and methods of fabricating thereof | Min-Feng Kao, Hsing-Chih Lin, Jen-Cheng Liu | 2024-03-26 |
| 11923338 | Stacked integrated circuits with redistribution lines | Cheng-Ying Ho, Jeng-Shyan Lin, Wen-I Hsu, Feng-Chi Hung, Ying-Ling Tsai | 2024-03-05 |
| 11916043 | Multi-wafer integration | Chin-Min Lin, Hung-Jen Hsu | 2024-02-27 |
| 11915977 | Interconnect structure for stacked device | Shu-Ting Tsai, Jeng-Shyan Lin, Jen-Cheng Liu, Feng-Chi Hung, Chih-Hui Huang +3 more | 2024-02-27 |
| 11908878 | Image sensor and manufacturing method thereof | Min-Feng Kao, Jen-Cheng Liu, Wen-Chang Kuo, Sheng-Chau Chen, Feng-Chi Hung +1 more | 2024-02-20 |
| 11901396 | Back side illuminated image sensor with reduced sidewall-induced leakage | Shuang-Ji Tsai, Jen-Cheng Liu, Wen-De Wang, Hsiao-Hui Tseng | 2024-02-13 |
| 11901388 | Device over photodetector pixel sensor | Jhy-Jyi Sze, Alexander Kalnitsky | 2024-02-13 |
| 11901387 | Image sensor | Min-Feng Kao, Jen-Cheng Liu, Wen-Chang Kuo, Sheng-Chau Chen, Feng-Chi Hung +1 more | 2024-02-13 |
| 11894410 | Bond pad structure for bonding improvement | Sin-Yao Huang, Ching-Chun Wang, Feng-Chi Hung, Ming-Tsong Wang, Shih Pei Chou | 2024-02-06 |
| 11854959 | Metal-insulator-metal device with improved performance | Min-Feng Kao, Jen-Cheng Liu, Hsing-Chih Lin, Kuan-Hua Lin | 2023-12-26 |
| 11837595 | Semiconductor device structure and method for manufacturing the same | Cheng-Ying Ho, Wen-De Wang, Jen-Cheng Liu | 2023-12-05 |