Issued Patents All Time
Showing 126–150 of 159 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8809910 | Thick AlN inter-layer for III-nitride layer on silicon substrate | Chi-Ming Chen, Po-Chun Liu | 2014-08-19 |
| 8809976 | Method and structure for a MRAM device with a bilayer passivation | Chih-Ming Chen, Cheng-Yuan Tsai, Kai-Wen Cheng | 2014-08-19 |
| 8803158 | High electron mobility transistor and method of forming the same | Han-Chin Chiu, Po-Chun Liu, Chi-Ming Chen, King-Yuen Wong | 2014-08-12 |
| 8791504 | Substrate breakdown voltage improvement for group III-nitride on a silicon substrate | Chi-Ming Chen, Po-Chun Liu, Hung-Ta Lin, Chin-Cheng Chang, Chia-Shiung Tsai +1 more | 2014-07-29 |
| 8790954 | Method of making wafer structure for backside illuminated color image sensor | Tzu-Hsuan Hsu, Yuan-Chih Hsieh, Dun-Nian Yaung | 2014-07-29 |
| 8772845 | Technique for smoothing an interface between layers of a semiconductor device | Chih-Ming Chen, Cheng-Yuan Tsai, Kai-Wen Cheng, Kuo-Ming Wu | 2014-07-08 |
| 8772831 | III-nitride growth method on silicon substrate | Chi-Ming Chen, Po-Chun Liu, Hung-Ta Lin, Chin-Cheng Chang, Chia-Shiung Tsai +1 more | 2014-07-08 |
| 8723185 | Reducing wafer distortion through a high CTE layer | Chi-Ming Chen, Chia-Shiung Tsai, Ho-yung David Hwang | 2014-05-13 |
| 8710560 | Embedded bonding pad for image sensors | Yuan-Chih Hsieh, Shih-Chang Liu, Shih-Chi Fu, Tzu-Hsuan Hsu, Gwo-Yuh Shiau +1 more | 2014-04-29 |
| 8629037 | Forming a protective film on a back side of a silicon wafer in a III-V family fabrication process | Chun-Feng Nieh, Hung-Ta Lin | 2014-01-14 |
| 8629531 | Structure and method to reduce wafer warp for gallium nitride on silicon wafer | Ming Chyi Liu, Hsieh Ching Pei, Jiun-Lei Jerry Yu, Chi-Ming Chen, Shih-Chang Liu +1 more | 2014-01-14 |
| 8629013 | Junction leakage reduction through implantation | Chun-Feng Nieh, Hung-Ta Lin | 2014-01-14 |
| 8624326 | FinFET device and method of manufacturing same | Chi-Ming Chen, Ho-yung David Hwang | 2014-01-07 |
| 8525286 | Method of making wafer structure for backside illuminated color image sensor | Tzu-Hsuan Hsu, Chris Hsieh, Dun-Nian Yaung | 2013-09-03 |
| 8476146 | Reducing wafer distortion through a low CTE layer | Chi-Ming Chen, Chia-Shiung Tsai, Ho-yung David Hwang | 2013-07-02 |
| 8383440 | Light shield for CMOS imager | Wen-De Wang, Dun-Nian Yaung, Shou-Gwo Wuu | 2013-02-26 |
| 8344343 | Composite film for phase change memory devices | Tung-Ti Yeh, Neng-Kuo Chen, Cheng-Yuan Tsai, Chia-Shiung Tsai | 2013-01-01 |
| 8334187 | Hard mask for thin film resistor manufacture | Li-Wen Chang, Der-Chyang Yeh, Hsun-Chung Kuang, Hua-Chou Tseng, Chih-Ping Chao +2 more | 2012-12-18 |
| 8173518 | Method of wafer bonding | Martin Liu, Alex Hsu, Chia-Shiung Tsai | 2012-05-08 |
| 8080461 | Method of making a thin film resistor | Der-Chyang Yeh, Hsun-Chung Kuang, Ming Chyi Liu, Chih-Ping Chao, Alexander Kalnitsky | 2011-12-20 |
| 7935994 | Light shield for CMOS imager | Wen-De Wang, Dun-Nian Yaung, Shou-Gwo Wuu | 2011-05-03 |
| 7906418 | Semiconductor device having substantially planar contacts and body | Chi-Hsin Lo, Chia-Shiung Tsai | 2011-03-15 |
| 7799654 | Reduced refractive index and extinction coefficient layer for enhanced photosensitivity | Yuan-Chih Hsieh, Tsung-Hsun Huang, Tzu-Hsuan Hsu, Chia-Shiung Tsai | 2010-09-21 |
| 7786552 | Semiconductor device having hydrogen-containing layer | Tsung-Hsun Huang, Kuo-Yin Lin, Chih-Ta Wu, Chia-Shiung Tsai | 2010-08-31 |
| 7667261 | Split-gate memory cells and fabrication methods thereof | Chang-Jen Hsieh, Hung-Cheng Sung, Wen-Ting Chu, Chen-Ming Huang, Ya-Chen Kao +3 more | 2010-02-23 |