CH

Chris Hsieh

TSMC: 2 patents #6,667 of 12,232Top 55%
UM United Microelectronics: 1 patents #2,686 of 4,560Top 60%
Overall (All Time): #1,545,370 of 4,157,543Top 40%
3
Patents All Time

Issued Patents All Time

Showing 1–3 of 3 patents

Patent #TitleCo-InventorsDate
8525286 Method of making wafer structure for backside illuminated color image sensor Tzu-Hsuan Hsu, Dun-Nian Yaung, Chung-Yi Yu 2013-09-03
7638852 Method of making wafer structure for backside illuminated color image sensor Tzu-Hsuan Hsu, Dun-Nian Yaung, Chung-Yi Yu 2009-12-29
6531413 Method for depositing an undoped silicate glass layer Kevin Rui Luo 2003-03-11