Issued Patents All Time
Showing 1,751–1,775 of 1,955 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7265447 | Interconnect with composite layers and method for fabricating the same | Horng-Huei Tseng, Syun-Ming Jang, Chenming Hu | 2007-09-04 |
| 7250683 | Method to solve via poisoning for porous low-k dielectric | Ming-Hsing Tsai, Jing-Cheng Lin, Shau-Lin Shue | 2007-07-31 |
| 7232362 | Chemical mechanical polishing process for manufacturing semiconductor devices | Wen-Chih Chiou, Ying-Ho Chen | 2007-06-19 |
| 7193327 | Barrier structure for semiconductor devices | Shing-Chyang Pan, Shau-Lin Shue, Ching-Hua Hsieh, Cheng-Lin Huang, Hsien-Ming Lee +1 more | 2007-03-20 |
| 7187084 | Damascene method employing composite etch stop layer | Syun-Ming Jang, Chung-Shi Liu | 2007-03-06 |
| 7186652 | Method for preventing Cu contamination and oxidation in semiconductor device manufacturing | Boq-Kang Hwu, Chung-Shi Liu | 2007-03-06 |
| 7180193 | Via recess in underlying conductive line | Chung-Shi Liu, Horng-Huei Tseng | 2007-02-20 |
| 7176135 | EBR shape of spin-on low-k material providing good film stacking | Yu-Huei Chen, Sung-Ming Jang | 2007-02-13 |
| 7105928 | Copper wiring with high temperature superconductor (HTS) layer | Horng-Huei Tseng, Chenming Hu, Chao-Hsiung Wang | 2006-09-12 |
| 6977218 | Method for fabricating copper interconnects | Horng-Huei Tseng | 2005-12-20 |
| RE38914 | Dual damascene patterned conductor layer formation method without etch stop layer | Syun-Ming Jang | 2005-12-06 |
| 6958291 | Interconnect with composite barrier layers and method for fabricating the same | Horng-Huei Tseng, Syun-Ming Jang, Chenming Hu | 2005-10-25 |
| 6878615 | Method to solve via poisoning for porous low-k dielectric | Ming-Hsing Tsai, Jing-Cheng Lin, Shau-Lin Shue | 2005-04-12 |
| 6876062 | Seal ring and die corner stress relief pattern design to protect against moisture and metallic impurities | Tze-Liang Lee, Shih Chung Chen, Ming-Soah Liang | 2005-04-05 |
| 6876082 | Refractory metal nitride barrier layer with gradient nitrogen concentration | Hsien-Ming Lee, Shing-Chuang Pan, Chung-Shi Liu | 2005-04-05 |
| 6860769 | Cathode contact pin for an electroplating process | Chung-Shi Liu | 2005-03-01 |
| 6841466 | Method of selectively making copper using plating technology | Horng-Huei Tseng | 2005-01-11 |
| 6821905 | Method for avoiding carbon and nitrogen contamination of a dielectric insulating layer | Shing-Chyang Pan, Shwang-Ming Jeng, Grace H. Ho | 2004-11-23 |
| 6811670 | Method for forming cathode contact areas for an electroplating process | Chung-Shi Liu | 2004-11-02 |
| 6767833 | Method for damascene reworking | Tsu Shih | 2004-07-27 |
| 6764959 | Thermal compensation method for forming semiconductor integrated circuit microelectronic fabrication | Mo Yu, Shih-Chang Chen | 2004-07-20 |
| 6753259 | Method of improving the bondability between Au wires and Cu bonding pads | Syun-Ming Jang, Mong-Song Liang, Chung-Shi Liu, Jane-Bai Lai | 2004-06-22 |
| 6734110 | Damascene method employing composite etch stop layer | Syun-Ming Jang, Chung-Shi Liu | 2004-05-11 |
| 6734101 | Solution to the problem of copper hillocks | Tien-I Bao, Jeng Shwang-Ming, Syun-Ming Jang, Kuen-Chyr Lee | 2004-05-11 |
| 6734053 | Effective MIM fabrication method and apparatus to avoid breakdown and leakage on damascene copper process | Chung-Shi Liu | 2004-05-11 |