Issued Patents All Time
Showing 51–72 of 72 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7091596 | Semiconductor packages and leadframe assemblies | Byung Hoon Ahn | 2006-08-15 |
| 7064420 | Integrated circuit leadframe with ground plane | Byung Hoon Ahn, Zheng Zheng | 2006-06-20 |
| 6876069 | Ground plane for exposed package | Jefferey D. Punzalan, Hien Boon Tan, Zheng Zheng, Jae Hak Yee | 2005-04-05 |
| 6861288 | Stacked semiconductor packages and method for the fabrication thereof | Il Kwon Shim, Kambhampati Ramakrishna, Seng Guan Chow | 2005-03-01 |
| 6858470 | Method for fabricating semiconductor packages, and leadframe assemblies for the fabrication thereof | Byung Hoon Ahn | 2005-02-22 |
| 6803254 | Wire bonding method for a semiconductor package | Young-Kuk Park, Jae Dong Kim | 2004-10-12 |
| 6642610 | Wire bonding method and semiconductor package manufactured using the same | Young-Kuk Park, Jae Dong Kim | 2003-11-04 |
| 6630373 | Ground plane for exposed package | Jeffrey D. Punzalan, Hien Boon Tan, Zheng Zheng, Jae Hak Yee | 2003-10-07 |
| 6489667 | Semiconductor device and method of manufacturing such device | Il Kwon Shim, Chang Kyu Park, Vincent DiCaprio, Paul R. Hoffman | 2002-12-03 |
| 6462274 | Chip-scale semiconductor package of the fan-out type and method of manufacturing such packages | Il Kwon Shim, Chang Kyu Park, Vincent DiCaprio, Paul R. Hoffman | 2002-10-08 |
| 6414396 | Package for stacked integrated circuits | Il Kwon Shim, Vincent DiCaprio, Paul R. Hoffman | 2002-07-02 |
| 6150709 | Grid array type lead frame having lead ends in different planes | Won Sun Shin, Ju Hoon Yoon, Sung Bum Kwak, In Gyu Han | 2000-11-21 |
| 6020219 | Method of packaging fragile devices with a gel medium confined by a rim member | Thomas Dixon Dudderar, Venkataram R. Raju, George J. Shevchuk | 2000-02-01 |
| 5977624 | Semiconductor package and assembly for fabricating the same | Young Wook Heo | 1999-11-02 |
| 5897334 | Method for reproducing printed circuit boards for semiconductor packages including poor quality printed circuit board units and method for fabricating semiconductor packages using the reproduced printed circuit boards | Sun Ho Ha, Young Wook Heo | 1999-04-27 |
| 5866939 | Lead end grid array semiconductor package | Won Sun Shin, Ju Hoon Yoon, Sung Bum Kwak, In Gyu Han | 1999-02-02 |
| 5858815 | Semiconductor package and method for fabricating the same | Young Wook Heo | 1999-01-12 |
| 5834160 | Method and apparatus for forming fine patterns on printed circuit board | Alan Ferry, Maureen Y. Lau, Robert T. Scruton, Sr., King Lien Tai | 1998-11-10 |
| 5767447 | Electronic device package enclosed by pliant medium laterally confined by a plastic rim member | Thomas Dixon Dudderar, Venkataram R. Raju, George J. Shevchuk | 1998-06-16 |
| 5646828 | Thin packaging of multi-chip modules with enhanced thermal/power management | Yinon Degani, Thomas Dixon Dudderar, Alan Michael Lyons | 1997-07-08 |
| 5608262 | Packaging multi-chip modules without wire-bond interconnection | Yinon Degani, Thomas Dixon Dudderar, Alan Michael Lyons, King Lien Tai | 1997-03-04 |
| 5473512 | Electronic device package having electronic device boonded, at a localized region thereof, to circuit board | Yinon Degani, Thomas Dixon Dudderar, Venkataram R. Raju | 1995-12-05 |