Issued Patents All Time
Showing 26–50 of 72 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8198735 | Integrated circuit package with molded cavity | Seng Guan Chow, Il Kwon Shim | 2012-06-12 |
| 8163600 | Bridge stack integrated circuit package-on-package system | Seng Guan Chow, Il Kwon Shim | 2012-04-24 |
| 8125073 | Wafer integrated with permanent carrier and method therefor | Nathapong Suthiwongsunthorn, Pandi C. Marimuthu, Kock Liang Heng | 2012-02-28 |
| 8050047 | Integrated circuit package system with flexible substrate and recessed package | Seng Guan Chow, Il Kwon Shim, Kambhampati Ramakrishna | 2011-11-01 |
| 8031475 | Integrated circuit package system with flexible substrate and mounded package | Seng Guan Chow, Il Kwon Shim, Kambhampati Ramakrishna | 2011-10-04 |
| 8021924 | Encapsulant cavity integrated circuit package system and method of fabrication thereof | Il Kwon Shim, Kambhampati Ramakrishna, Seng Guan Chow | 2011-09-20 |
| 7969023 | Integrated circuit package system with triple film spacer having embedded fillers and method of manufacture thereof | Taeg Ki Lim, JaEun Yun | 2011-06-28 |
| 7880293 | Wafer integrated with permanent carrier and method therefor | Nathapong Suthiwongsunthorn, Pandi C. Marimuthu, Kock Liang Heng | 2011-02-01 |
| 7868468 | Wire bonding structure and method that eliminates special wire bondable finish and reduces bonding pitch on substrates | Rajendra D. Pendse, HunTeak Lee | 2011-01-11 |
| 7855100 | Integrated circuit package system with an encapsulant cavity and method of fabrication thereof | Il Kwon Shim, Kambhampati Ramakrishna, Seng Guan Chow | 2010-12-21 |
| 7790504 | Integrated circuit package system | Kambhampati Ramakrishna, Seng Guan Chow | 2010-09-07 |
| 7746656 | Offset integrated circuit package-on-package stacking system | Il Kwon Shim, Seng Guan Chow | 2010-06-29 |
| 7733661 | Chip carrier and fabrication method | Dean Paul Kossives | 2010-06-08 |
| 7732907 | Integrated circuit package system with edge connection system | Il Kwon Shim, Seng Guan Chow | 2010-06-08 |
| 7525812 | Chip carrier and fabrication method | Dean Paul Kossives | 2009-04-28 |
| 7518224 | Offset integrated circuit package-on-package stacking system | Il Kwon Shim, Seng Guan Chow | 2009-04-14 |
| 7435619 | Method of fabricating a 3-D package stacking system | Il Kwon Shim, Seng Guan Chow | 2008-10-14 |
| 7429787 | Semiconductor assembly including chip scale package and second substrate with exposed surfaces on upper and lower sides | Marcos Karnezos, Il Kwon Shim, Kambhampati Ramakrishna, Seng Guan Chow | 2008-09-30 |
| 7413933 | Integrated circuit package with leadframe locked encapsulation and method of manufacture therefor | Jeffrey D. Punzalan, Jae Hun Ku | 2008-08-19 |
| 7372141 | Semiconductor stacked package assembly having exposed substrate surfaces on upper and lower sides | Marcos Karnezos, Il Kwon Shim, Kambhampati Ramakrishna, Seng Guan Chow | 2008-05-13 |
| 7364945 | Method of mounting an integrated circuit package in an encapsulant cavity | Il Kwon Shim, Kambhampati Ramakrishna, Seng Guan Chow | 2008-04-29 |
| 7309913 | Stacked semiconductor packages | Il Kwon Shim, Kambhampati Ramakrishna, Seng Guan Chow | 2007-12-18 |
| 7304859 | Chip carrier and fabrication method | Dean Paul Kossives | 2007-12-04 |
| 7217599 | Integrated circuit package with leadframe locked encapsulation and method of manufacture therefor | Jeffrey D. Punzalan, Jae Hun Ku | 2007-05-15 |
| 7135760 | Moisture resistant integrated circuit leadframe package | Byung Hoon Ahn | 2006-11-14 |