Issued Patents All Time
Showing 76–100 of 118 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9385041 | Method for insulating singulated electronic die | — | 2016-07-05 |
| 9299664 | Method of forming an EM protected semiconductor die | Michael J. Seddon, Gordon M. Grivna | 2016-03-29 |
| 9275957 | EM protected semiconductor die | Michael J. Seddon, Gordon M. Grivna | 2016-03-01 |
| 9263390 | Semiconductor component that includes a protective structure | Michael J. Seddon | 2016-02-16 |
| 9219010 | Method of manufacturing a semiconductor component | Michael J. Seddon | 2015-12-22 |
| 8445375 | Method for manufacturing a semiconductor component | Michael J. Seddon | 2013-05-21 |
| 8253239 | Multi-chip semiconductor connector | Phillip Celaya, Joseph K. Fauty, James P. Letterman, Jr., Stephen St. Germain, Jay A. Yoder | 2012-08-28 |
| 8084335 | Method of thinning a semiconductor wafer using a film frame | Michael J. Seddon | 2011-12-27 |
| 7944044 | Semiconductor package structure having enhanced thermal dissipation characteristics | Michael J. Seddon | 2011-05-17 |
| 7875964 | Multi-chip semiconductor connector and method | Phillip Celaya, Joseph K. Fauty, James P. Letterman, Jr., Stephen St. Germain, Jay A. Yoder | 2011-01-25 |
| 7820528 | Method of forming a leaded molded array package | William F. Burghout, Joseph K. Fauty, James P. Letterman, Jr., Jay A. Yoder | 2010-10-26 |
| 7755179 | Semiconductor package structure having enhanced thermal dissipation characteristics | Michael J. Seddon, Kent L. Kime, Dluong Ngan Leong, Yeu Wen Lee | 2010-07-13 |
| 7588999 | Method of forming a leaded molded array package | William F. Burghout, Joseph K. Fauty, James P. Letterman, Jr., Jay A. Yoder | 2009-09-15 |
| 7566967 | Semiconductor package structure for vertical mount and method | Stephen St. Germain, Bruce Alan Huing | 2009-07-28 |
| 7508060 | Multi-chip semiconductor connector assemblies | Phillip Celaya, Joseph K. Fauty, James P. Letterman, Jr., Stephen Germain, Jay A. Yoder | 2009-03-24 |
| 7498195 | Multi-chip semiconductor connector assembly method | Phillip Celaya, Joseph K. Fauty, James P. Letterman, Jr., Stephen St. Germain, Jay A. Yoder | 2009-03-03 |
| 7495323 | Semiconductor package structure having multiple heat dissipation paths and method of manufacture | Stephen St. Germain, Phillip Celaya, Roger M. Arbuthnot | 2009-02-24 |
| 7397120 | Semiconductor package structure for vertical mount and method | Stephen St. Germain, Bruce Alan Huling | 2008-07-08 |
| 7298034 | Multi-chip semiconductor connector assemblies | Phillip Celaya, Joseph K. Fauty, James P. Letterman, Jr., Stephen St. Germain, Jay A. Yoder | 2007-11-20 |
| 7265454 | Semiconductor device and method of producing high contrast identification mark | Michael J. Seddon | 2007-09-04 |
| 7227240 | Semiconductor device with wire bond inductor and method | James H. Knapp, Harold Anderson, Yenting Wen, Cang Ngo | 2007-06-05 |
| 7202105 | Multi-chip semiconductor connector assembly method | Phillip Celaya, Joseph K. Fauty, James P. Letterman, Jr., Stephen St. Germain, Jay A. Yoder | 2007-04-10 |
| 7202106 | Multi-chip semiconductor connector and method | Phillip Celaya, Joseph K. Fauty, James P. Letterman, Jr., Stephen St. Germain, Jay A. Yoder | 2007-04-10 |
| 7135761 | Robust power semiconductor package | Jeffrey Pearse, Stephen St. Germain | 2006-11-14 |
| 7135356 | Semiconductor device and method of producing a high contrast identification mark | Michael J. Seddon | 2006-11-14 |