Issued Patents All Time
Showing 26–50 of 118 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11508679 | Polymer resin and compression mold chip scale package | Yusheng LIN, Soon Wei WANG, Chee Hiong CHEW | 2022-11-22 |
| 11437291 | Multichip module supports and related methods | Michael J. Seddon | 2022-09-06 |
| 11437304 | Substrate structures and methods of manufacture | Yusheng LIN, Roger P. Stout, Chee Hiong CHEW, Sadamichi Takakusaki | 2022-09-06 |
| 11430746 | Multidie supports for reducing die warpage | Michael J. Seddon | 2022-08-30 |
| 11404277 | Die sidewall coatings and related methods | Yusheng LIN, Michael J. Seddon, Chee Hiong CHEW, Soon Wei WANG, Eiji KUROSE | 2022-08-02 |
| 11404276 | Semiconductor packages with thin die and related methods | Chee Hiong CHEW, Soon Wei WANG, Eiji KUROSE | 2022-08-02 |
| 11393692 | Semiconductor package electrical contact structures and related methods | Michael J. Seddon, Yusheng LIN, Takashi Noma, Eiji KUROSE | 2022-07-19 |
| 11367619 | Semiconductor package electrical contacts and related methods | Yusheng LIN, Michael J. Seddon, Takashi Noma, Eiji KUROSE | 2022-06-21 |
| 11361970 | Silicon-on-insulator die support structures and related methods | Michael J. Seddon, Eiji KUROSE, Chee Hiong CHEW, Soon Wei WANG | 2022-06-14 |
| 11348796 | Backmetal removal methods | Michael J. Seddon, Chee Hiong CHEW, Soon Wei WANG, Eiji KUROSE | 2022-05-31 |
| 11342189 | Semiconductor packages with die including cavities and related methods | Michael J. Seddon, Chee Hiong CHEW, Soon Wei WANG, Eiji KUROSE | 2022-05-24 |
| 11257759 | Isolation in a semiconductor device | Yusheng LIN, Takashi Noma | 2022-02-22 |
| 11211359 | Semiconductor device and method of forming modular 3D semiconductor package with horizontal and vertical oriented substrates | Michael J. Seddon | 2021-12-28 |
| 11049833 | Semiconductor packages with an intermetallic layer | Michael J. Seddon | 2021-06-29 |
| 10971428 | Semiconductor baseplates | Atapol Prajuckamol, Chee Hiong CHEW, Yushuang YAO | 2021-04-06 |
| 10950534 | Through-substrate via structure and method of manufacture | Michael J. Seddon | 2021-03-16 |
| 10916485 | Molded wafer level packaging | Soon Wei WANG, Jin Yoong LIONG, Chee Hiong CHEW | 2021-02-09 |
| 10903154 | Semiconductor device and method of forming cantilevered protrusion on a semiconductor die | Michael J. Seddon | 2021-01-26 |
| 10897821 | Method of making single reflow power pin connections | Yushuang YAO, Atapol Prajuckamol, Chee Hiong CHEW, Yusheng LIN | 2021-01-19 |
| 10825786 | Polymer resin and compression mold chip scale package | Yusheng LIN, Soon Wei WANG, Chee Hiong CHEW | 2020-11-03 |
| 10825764 | Semiconductor device and method of forming micro interconnect structures | Jefferson W. Hall, Michael J. Seddon | 2020-11-03 |
| 10818587 | Semiconductor device and method of forming a curved image sensor | Michael J. Seddon, Eric Woolsey | 2020-10-27 |
| 10748850 | Thinned semiconductor package and related methods | Yusheng LIN, Takashi Noma | 2020-08-18 |
| 10741484 | Stacked semiconductor device structure and method | Michael J. Seddon | 2020-08-11 |
| 10607903 | Semiconductor package with elastic coupler and related methods | Yusheng LIN, Chee Hiong CHEW | 2020-03-31 |