Issued Patents All Time
Showing 51–75 of 118 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10559510 | Molded wafer level packaging | Soon Wei WANG, Jin Yoong LIONG, Chee Hiong CHEW | 2020-02-11 |
| 10453784 | Semiconductor device and method of forming cantilevered protrusion on a semiconductor die | Michael J. Seddon | 2019-10-22 |
| 10446480 | Through-substrate via structure and method of manufacture | Michael J. Seddon | 2019-10-15 |
| 10319652 | Semiconductor package with elastic coupler and related methods | Yusheng LIN, Chee Hiong CHEW | 2019-06-11 |
| 10283466 | Polymer resin and compression mold chip scale package | Yusheng LIN, Soon Wei WANG, Chee Hiong CHEW | 2019-05-07 |
| 10231340 | Single reflow power pin connections | Yushuang YAO, Atapol Prajuckamol, Chee Hiong CHEW, Yusheng LIN | 2019-03-12 |
| 10199316 | Semiconductor device and method of aligning semiconductor wafers for bonding | Michael J. Seddon | 2019-02-05 |
| 10163772 | Stacked semiconductor device structure and method | Michael J. Seddon | 2018-12-25 |
| 10115716 | Die bonding to a board | Michael J. Seddon | 2018-10-30 |
| 10115662 | Semiconductor device and method of forming a curved image sensor | Michael J. Seddon, Eric Woolsey | 2018-10-30 |
| 10090233 | Semiconductor device and method of forming micro interconnect structures | Jefferson W. Hall, Michael J. Seddon | 2018-10-02 |
| 10079199 | Through-substrate via structure and method of manufacture | Michael J. Seddon | 2018-09-18 |
| 10014245 | Method for removing material from a substrate using in-situ thickness measurement | Michael J. Seddon | 2018-07-03 |
| 9941257 | Embedded stacked die packages and related methods | Yusheng LIN, Yenting Wen, Chee Hiong CHEW, Azhar Aripin | 2018-04-10 |
| 9935045 | Semiconductor device and method of forming cantilevered protrusion on a semiconductor die | Michael J. Seddon | 2018-04-03 |
| 9893058 | Method of manufacturing a semiconductor device having reduced on-state resistance and structure | Michael J. Seddon | 2018-02-13 |
| 9852972 | Semiconductor device and method of aligning semiconductor wafers for bonding | Michael J. Seddon | 2017-12-26 |
| 9847310 | Flip chip bonding alloys | Michael J. Seddon | 2017-12-19 |
| 9847270 | Method for insulating singulated electronic die | — | 2017-12-19 |
| 9748163 | Die support for enlarging die size | Soon Wei WANG, How Kiat Liew, Chee Hiong CHEW | 2017-08-29 |
| 9711434 | Stacked semiconductor device structure and method | Michael J. Seddon | 2017-07-18 |
| 9691732 | Semiconductor package with elastic coupler and related methods | Yusheng LIN, Chee Hiong CHEW | 2017-06-27 |
| 9679878 | Embedded stacked die packages and related methods | Yusheng LIN, Yenting Wen, Chee Hiong CHEW, Azhar Aripin | 2017-06-13 |
| 9564409 | Methods of forming semiconductor packages with an intermetallic layer comprising tin and at least one of silver, copper or nickel | Michael J. Seddon | 2017-02-07 |
| 9431311 | Semiconductor package with elastic coupler and related methods | Yusheng LIN, Chee Hiong CHEW | 2016-08-30 |