Issued Patents All Time
Showing 101–118 of 118 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| D489338 | Packaged semiconductor device | Michael J. Seddon, Kent L. Kime | 2004-05-04 |
| 6436300 | Method of manufacturing electronic components | Eric Woolsey, Douglas G. Mitchell, George F. Carney, Cary B. Powell | 2002-08-20 |
| 6413878 | Method of manufacturing electronic components | Eric Woolsey, Douglas G. Mitchell, George F. Carney, Cary B. Powell | 2002-07-02 |
| 6093972 | Microelectronic package including a polymer encapsulated die | George Amos Carson, Phillip Celaya, Harry Fuerhaupter, Frank Tim Jones, Donald H. Klosterman +3 more | 2000-07-25 |
| 5933558 | Optoelectronic device and method of assembly | Joseph E. Sauvageau, James H. Knapp, Laura J. Norton | 1999-08-03 |
| 5895229 | Microelectronic package including a polymer encapsulated die, and method for forming same | George Amos Carson, Phillip Celaya, Harry Fuerhaupter, Frank Tim Jones, Donald H. Klosterman +3 more | 1999-04-20 |
| 5883996 | Electronic component for aligning a light transmitting structure | James H. Knapp, Laura J. Norton | 1999-03-16 |
| 5773359 | Interconnect system and method of fabrication | Douglas G. Mitchell, Eric Woolsey | 1998-06-30 |
| 5659648 | Polyimide optical waveguide having electrical conductivity | James H. Knapp | 1997-08-19 |
| 5583747 | Thermoplastic interconnect for electronic device and method for making | John H. Baird | 1996-12-10 |
| 5529682 | Method for making semiconductor devices having electroplated leads | James H. Knapp | 1996-06-25 |
| 5480835 | Electrical interconnect and method for forming the same | George F. Carney, Douglas G. Mitchell | 1996-01-02 |
| 5467253 | Semiconductor chip package and method of forming | James K. Heckman, Harry J. Geyer | 1995-11-14 |
| 5319242 | Semiconductor package having an exposed die surface | Edward M. Majors, James H. Knapp | 1994-06-07 |
| 5232144 | Apparatus for tape automated bonding | Harry J. Geyer, Renee M. Gregg | 1993-08-03 |
| 5075258 | Method for plating tab leads in an assembled semiconductor package | Cary B. Powell, George F. Carney, Marion I. Simmons | 1991-12-24 |
| 4975146 | Plasma removal of unwanted material | James H. Knapp, George F. Carney | 1990-12-04 |
| 4877482 | Nitride removal method | James H. Knapp, George F. Carney | 1989-10-31 |