Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5319242 | Semiconductor package having an exposed die surface | Francis J. Carney, James H. Knapp | 1994-06-07 |
| 4387283 | Apparatus and method of forming aluminum balls for ball bonding | James R. Peterson | 1983-06-07 |