Issued Patents All Time
Showing 76–100 of 137 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7042099 | Semiconductor device containing a dummy wire | Nobuyuki Kurashima, Gaku Minamihaba, Dai Fukushima, Yoshikuni Tateyama | 2006-05-09 |
| 6995090 | Polishing slurry for use in CMP of SiC series compound, polishing method, and method of manufacturing semiconductor device | Gaku Minamihaba, Nobuyuki Kurashima | 2006-02-07 |
| 6984582 | Method of making semiconductor device by polishing with intermediate clean polishing | Dai Fukushima, Gaku Minamihaba, Yoshikuni Tateyama | 2006-01-10 |
| 6935932 | Polishing apparatus and method | Norio Kimura, Mitsuhiko Shirakashi, Katsuya Okumura, You Ishii, Junji Kunisawa | 2005-08-30 |
| 6935928 | Chemical mechanical polishing aqueous dispersion and chemical mechanical polishing method | Kazuhito Uchikura, Kazuo Nishimoto, Masayuki Hattori, Nobuo Kawahashi, Yukiteru Matsui +3 more | 2005-08-30 |
| 6924227 | Slurry for chemical mechanical polishing and method of manufacturing semiconductor device | Gaku Minamihaba, Nobuyuki Kurashima, Nobuo Kawahashi, Masayuki Hattori, Kazuo Nishimoto | 2005-08-02 |
| 6924236 | Manufacturing method of semiconductor device | Katsuya Okumura | 2005-08-02 |
| 6913513 | Polishing apparatus | Norio Kimura, Katsuya Okumura | 2005-07-05 |
| 6896590 | CMP slurry and method for manufacturing a semiconductor device | Gaku Minamihaba | 2005-05-24 |
| 6897143 | Method of manufacturing semiconductor device including two-step polishing operation for cap metal | Hiroshi Toyoda, Gaku Minamihaba, Dai Fukushima, Tetsuo Matsuda, Hisashi Kaneko | 2005-05-24 |
| 6875088 | Polishing member and method of manufacturing semiconductor device | Yukiteru Matsui | 2005-04-05 |
| 6858936 | Semiconductor device having an improved construction in the interlayer insulating film | Gaku Minamihaba, Dai Fukushima, Yoshikuni Tateyama | 2005-02-22 |
| 6858539 | Post-CMP treating liquid and method for manufacturing semiconductor device | Gaku Minamihaba, Yukiteru Matsui, Nobuyuki Kurashima | 2005-02-22 |
| 6794285 | Slurry for CMP, and method of manufacturing semiconductor device | Yukiteru Matsui, Gaku Minamihaba | 2004-09-21 |
| 6790769 | CMP slurry and method of manufacturing semiconductor device | Nobuyuki Kurashima, Gaku Minamihaba | 2004-09-14 |
| 6740590 | AQUEOUS DISPERSION, AQUEOUS DISPERSION FOR CHEMICAL MECHANICAL POLISHING USED FOR MANUFACTURE OF SEMICONDUCTOR DEVICES, METHOD FOR MANUFACTURE OF SEMICONDUCTOR DEVICES, AND METHOD FOR FORMATION OF EMBEDDED WRITING | Gaku Minamihaba, Yukiteru Matsui, Katsuya Okumura, Akira Iio, Masayuki Hattori | 2004-05-25 |
| 6726540 | Polishing cloth and method of manufacturing semiconductor device using the same | — | 2004-04-27 |
| 6722964 | Polishing apparatus and method | Norio Kimura, Mitsuhiko Shirakashi, Katsuya Okumura, You Ishii, Junji Kunisawa | 2004-04-20 |
| 6723572 | Method for monitoring the shape of the processed surfaces of semiconductor devices and equipment for manufacturing the semiconductor devices | Katsuya Okumura | 2004-04-20 |
| 6720250 | Method of manufacturing a semiconductor device using a slurry for chemical mechanical polishing of copper | Gaku Minamihaba | 2004-04-13 |
| 6653267 | Aqueous dispersion for chemical mechanical polishing used for polishing of copper | Gaku Minamihaba, Masayuki Motonari, Masayuki Hattori, Nobuo Kawahashi | 2003-11-25 |
| 6609950 | Method for polishing a substrate | Norio Kimura, Yu Ishii, Hirokuni Hiyama, Katsuya Okumura | 2003-08-26 |
| 6610629 | Process for producing an oxide catalyst for oxidation or ammoxidation | Hidenori Hinago | 2003-08-26 |
| 6611060 | Semiconductor device having a damascene type wiring layer | Hiroshi Toyoda, Gaku Minamihaba, Dai Fukushima, Tetsuo Matsuda, Hisashi Kaneko | 2003-08-26 |
| 6576554 | Slurry for CMP, method of forming thereof and method of manufacturing semiconductor device including a CMP process | Yukiteru Matsui, Gaku Minamihaba, Dai Fukushima | 2003-06-10 |