HY

Hiroyuki Yano

KT Kabushiki Kaisha Toshiba: 99 patents #81 of 21,451Top 1%
KU Kyoto University: 12 patents #17 of 1,688Top 2%
EB Ebara: 12 patents #179 of 1,611Top 15%
JS Jsr: 9 patents #113 of 1,137Top 10%
NC Nippon Paper Industries Co.: 7 patents #31 of 535Top 6%
Rohm Co.: 6 patents #487 of 2,292Top 25%
AC Asahi Kasei Chemicals: 6 patents #35 of 543Top 7%
MC Mitsubishi Chemical: 5 patents #358 of 3,022Top 15%
DI Dic: 3 patents #189 of 844Top 25%
DP Daio Paper: 3 patents #54 of 258Top 25%
OH Oji Holdings: 3 patents #32 of 176Top 20%
Pioneer: 3 patents #574 of 1,730Top 35%
AK Asahi Kasei Kabushiki Kaisha: 2 patents #302 of 1,220Top 25%
SP Seiko Pmc: 2 patents #3 of 34Top 9%
HI Hitachi: 2 patents #13,388 of 28,497Top 50%
IBM: 2 patents #32,839 of 70,183Top 50%
Aisin Seiki Kabushiki Kaisha: 2 patents #1,427 of 3,782Top 40%
TO Toyota: 1 patents #15,335 of 26,838Top 60%
KC Kansai Technology Licensing Organization Co.: 1 patents #2 of 26Top 8%
MK Mitsubishi Denki K.K.: 1 patents #164 of 577Top 30%
Mitsubishi Electric: 1 patents #15,491 of 25,717Top 65%
MU Monash University: 1 patents #133 of 420Top 35%
NC Nippon Steel Chemical Co.: 1 patents #136 of 380Top 40%
NT NTT: 1 patents #2,911 of 4,871Top 60%
NL Nissei Limited: 1 patents #25 of 53Top 50%
SC Siemens Components: 1 patents #6 of 30Top 20%
SI Sumitomo Rubber Industries: 1 patents #1,096 of 1,637Top 70%
TU Tottori University: 1 patents #6 of 32Top 20%
📍 Uji, NY: #1 of 1 inventorsTop 100%
Overall (All Time): #7,511 of 4,157,543Top 1%
137
Patents All Time

Issued Patents All Time

Showing 51–75 of 137 patents

Patent #TitleCo-InventorsDate
7494931 Method for fabricating semiconductor device and polishing method Dai Fukushima, Gaku Minamihaba, Nobuyuki Kurashima, Susumu Yamamoto 2009-02-24
7465668 Method of manufacturing semiconductor device Dai Fukushima, Gaku Minamihaba 2008-12-16
7459398 Slurry for CMP, polishing method and method of manufacturing semiconductor device Gaku Minamihaba, Yukiteru Matsui 2008-12-02
7455901 Fiber-reinforced composite material, method for manufacturing the same and applications thereof Junji Sugiyama, Masaya Nogi, Shin-ichiro Iwamoto, Keishin Handa, Akira Nagai +7 more 2008-11-25
7452819 Chemical mechanical polishing method of organic film and method of manufacturing semiconductor device Yukiteru Matsui, Gaku Minamihaba, Yoshikuni Tateyama, Atsushi Shigeta 2008-11-18
7435682 Method of manufacturing semiconductor device Yukiteru Matsui, Gaku Minamihaba, Atsushi Shigeta, Satoko Seta, Hirokazu Kato 2008-10-14
7419420 Substrate holding mechanism, substrate polishing apparatus and substrate polishing method Tetsuji Togawa, Toshio Watanabe, Gen Toyota, Kenji Iwade, Yoshikuni Tateyama 2008-09-02
7419910 Slurry for CMP, polishing method and method of manufacturing semiconductor device Gaku Minamihaba, Dai Fukushima, Susumu Yamamoto 2008-09-02
7416942 Method for manufacturing semiconductor device Yukiteru Matsui, Shinichi Hirasawa, Atsushi Shigeta, Kiyotaka Miyano, Takeshi Nishioka 2008-08-26
7402521 Method for chemically mechanically polishing organic film, method of manufacturing semiconductor device, and program therefor Yukiteru Matsui, Gaku Minamihaba, Atsushi Shigeta 2008-07-22
7378149 High strength material using cellulose microfibrils Susumu Nakahara 2008-05-27
7364667 Slurry for CMP and CMP method Gaku Minamihaba 2008-04-29
7332104 Slurry for CMP, polishing method and method of manufacturing semiconductor device Gaku Minamihaba, Yukiteru Matsui 2008-02-19
7307344 Semiconductor device including a discontinuous film and method for manufacturing the same Gaku Minamihaba, Nobuyuki Kurashima, Susumu Yamamoto 2007-12-11
7307023 Polishing method of Cu film and method for manufacturing semiconductor device Dai Fukushima, Gaku Minamihaba, Susumu Yamamoto 2007-12-11
7291057 Apparatus for polishing a substrate Norio Kimura, Yu Ishii, Hirokuni Hiyama, Katsuya Okumura 2007-11-06
7241205 Method of processing a substrate Gen Toyota, Atsushi Shigeta 2007-07-10
7217662 Method of processing a substrate Gen Toyota, Atsushi Shigeta 2007-05-15
7198729 CMP slurry and method of manufacturing semiconductor device Nobuyuki Kurashima, Gaku Minamihaba 2007-04-03
7166017 Slurry for CMP, polishing method and method of manufacturing semiconductor device Gaku Minamihaba, Yukiteru Matsui 2007-01-23
7144804 Semiconductor device and method of manufacturing the same Gaku Minamihaba, Dai Fukushima, Yoshikuni Tateyama 2006-12-05
7138073 Slurry for chemical mechanical polishing for copper and method of manufacturing semiconductor device using the slurry Gaku Minamihaba 2006-11-21
7108589 Polishing apparatus and method Norio Kimura, Mitsuhiko Shirakashi, Katsuya Okumura, You Ishii, Junji Kunisawa 2006-09-19
7071108 Chemical mechanical polishing slurry containing abrasive particles exhibiting photocatalytic function Yukiteru Matsui, Gaku Minamihaba 2006-07-04
7060621 Slurry for CMP, polishing method and method of manufacturing semiconductor device Gaku Minamihaba, Yukiteru Matsui 2006-06-13