Issued Patents All Time
Showing 1–25 of 77 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11705396 | Method to form air gap structure with dual dielectric layer | Craig R. Gruszecki, Ju Jin An, Tim H. Lee, Todd J. Van Kleeck | 2023-07-18 |
| 11671066 | Manufacturing method for an artificially oriented piezoelectric film for integrated filters | Bhupesh Chandra | 2023-06-06 |
| 11127678 | Dual dielectric layer for closing seam in air gap structure | Craig R. Gruszecki, Ju Jin An, Tim H. Lee, Todd J. Van Kleeck | 2021-09-21 |
| 10546822 | Seal ring structure of integrated circuit and method of forming same | Nicholas A. Polomoff | 2020-01-28 |
| 10504807 | Time temperature monitoring system | Taryn J. Davis, Jonathan Fry, Terence L. Kane, Christopher F. Klabes, Andrew J. Martin +2 more | 2019-12-10 |
| 10483943 | Artificially oriented piezoelectric film for integrated filters | Bhupesh Chandra | 2019-11-19 |
| 10438902 | Arc-resistant crackstop | Nicholas A. Polomoff, Shaoning Yao, Anupam ARORA | 2019-10-08 |
| 10217682 | Time temperature monitoring system | Taryn J. Davis, Jonathan Fry, Terence L. Kane, Christopher F. Klabes, Andrew J. Martin +2 more | 2019-02-26 |
| 10169525 | Multiple-depth trench interconnect technology at advanced semiconductor nodes | Stephen E. Greco, Rasit Onur Topaloglu | 2019-01-01 |
| 10109600 | Crackstop structures | Nicholas A. Polomoff | 2018-10-23 |
| 10060974 | Electrical circuit odometer sensor array | Jonathan Fry, Christopher F. Klabes, Andrew J. Martin, Kathryn E. Schlichting, Melissa A. Smith | 2018-08-28 |
| 10062748 | Segmented guard-ring and chip edge seals | Anthony K. Stamper, Zhong-Xiang He | 2018-08-28 |
| 10032683 | Time temperature monitoring system | Taryn J. Davis, Jonathan Fry, Terence L. Kane, Christopher F. Klabes, Andrew J. Martin +2 more | 2018-07-24 |
| 9852959 | Corrosion resistant chip sidewall connection with crackstop and hermetic seal | John A. Fitzsimmons, Michael J. Shapiro, Natalia Borjemscaia | 2017-12-26 |
| 9710592 | Multiple-depth trench interconnect technology at advanced semiconductor nodes | Stephen E. Greco, Rasit Onur Topaloglu | 2017-07-18 |
| 9502325 | Integrated circuit barrierless microfluidic channel | Lawrence A. Clevenger, Joyeeta Nag, Yiheng Xu | 2016-11-22 |
| 9454631 | Stitch-derived via structures and methods of generating the same | Stephen E. Greco, Rasit Onur Topaloglu | 2016-09-27 |
| 9443776 | Method and structure for determining thermal cycle reliability | Ronald G. Filippi, Jason P. Gill, Paul S. McLaughlin, Conal E. Murray, Hazara S. Rathore +2 more | 2016-09-13 |
| 9412654 | Graphene sacrificial deposition layer on beol copper liner-seed for mitigating queue-time issues between liner and plating step | Junjing Bao, Lawrence A. Clevenger, Joyeeta Nag, Richard S. Wise, Yiheng Xu | 2016-08-09 |
| 9385062 | Integrated circuit barrierless microfluidic channel | Lawrence A. Clevenger, Joyeeta Nag, Yiheng Xu | 2016-07-05 |
| 9373561 | Integrated circuit barrierless microfluidic channel | Lawrence A. Clevenger, Joyeeta Nag, Yiheng Xu | 2016-06-21 |
| 9362230 | Methods to form conductive thin film structures | Lawrence A. Clevenger, Joyeeta Nag, Yiheng Xu | 2016-06-07 |
| 9287186 | Method and structure for determining thermal cycle reliability | Ronald G. Filippi, Jason P. Gill, Paul S. McLaughlin, Conal E. Murray, Hazara S. Rathore +2 more | 2016-03-15 |
| 8343868 | Device and methodology for reducing effective dielectric constant in semiconductor devices | Daniel C. Edelstein, Matthew E. Colburn, Edward C. Cooney, III, Timothy J. Dalton, John A. Fitzsimmons +10 more | 2013-01-01 |
| 8237246 | Deep trench crackstops under contacts | Matthew S. Angyal, Lawrence A. Clevenger, Satyanarayana V. Nitta, Shaoning Yao | 2012-08-07 |