Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11022792 | Coupling a magnet with a MEMS device | Kyle Yazzie, Anna M. Prakash, Liwei Wang, Robert Starkston, Arnab Choudhury +3 more | 2021-06-01 |
| 10356912 | Apparatus and method for conformal coating of integrated circuit packages | Priyanka Dobriyal, Chester C. Lee, Raiyomand Aspandiar | 2019-07-16 |
| 10317952 | Compartment for magnet placement | Sandeep S. Iyer, Amanuel M. Abebaw, Mark Saltas, Mayank Patel, Charavana K. Gurumurthy +1 more | 2019-06-11 |
| 10269695 | Method for forming an electrical device and electrical devices | Robert F. Cheney, Ashish Dhall | 2019-04-23 |
| 10115606 | Methods of promoting adhesion between underfill and conductive bumps and structures formed thereby | Yiqun Bai, Yuying Wei, Arjun Krishnan, Yonghao Xiu, Beverly J. Canham +3 more | 2018-10-30 |
| 9704767 | Mold compound with reinforced fibers | Yiqun Bai, Nisha Ananthakrishnan, Arjun Krishnan | 2017-07-11 |
| 9691675 | Method for forming an electrical device and electrical devices | Robert F. Cheney, Ashish Dhall | 2017-06-27 |
| 9640415 | Robust ink formulations for durable markings on microelectronic packages and its extendibility as a barrier material for thermal and sealant materials | Randall D. Lowe, Jr., Nisha Ananthakrishnan, James C. Matayabas, Jr., Arjun Krishnan, Hitesh Arora | 2017-05-02 |
| 9431274 | Method for reducing underfill filler settling in integrated circuit packages | Manish Dubey, Hsin-Yu Li, Michelle S. Phen, Hitesh Arora, Nisha Ananthakrishnan +3 more | 2016-08-30 |
| 9330993 | Methods of promoting adhesion between underfill and conductive bumps and structures formed thereby | Yiqun Bai, Yuying Wei, Arjun Krishnan, Yonghao Xiu, Beverly J. Canham +3 more | 2016-05-03 |
| 8900919 | Robust ink formulations for durable markings on microelectronic packages and its extendibility as a barrier material for thermal and sealant materials | Randall D. Lowe, Jr., Nisha Ananthakrishnan, James C. Matayabas, Jr., Arjun Krishnan, Hitesh Arora | 2014-12-02 |
| 8895365 | Techniques and configurations for surface treatment of an integrated circuit substrate | Rajen S. Sidhu, Nisha Ananthakrishnan, Sivakumar Nagarajan, Wei Tan, Sandeep Razdan +1 more | 2014-11-25 |