Issued Patents All Time
Showing 1–25 of 25 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12032013 | Substrate inspection device and substrate inspection method | Gu Hyun JUNG, Young Rok Kim, Chul Joo HWANG, Jin An JUNG | 2024-07-09 |
| 11726134 | Substrate inspection device and substrate inspection method | Gu Hyun JUNG, Young Rok Kim, Chul Joo HWANG, Jin An JUNG | 2023-08-15 |
| 8278766 | Wafer level stack structure for system-in-package and method thereof | Kang-Wook Lee, Young-Hee Song, Gu-Sung Kim | 2012-10-02 |
| 7855144 | Method of forming metal lines and bumps for semiconductor devices | Soon-Bum Kim, Sung-Min Sim, Dong-Hyeon Jang, Jae-Sik Chung | 2010-12-21 |
| 7824959 | Wafer level stack structure for system-in-package and method thereof | Kang-Wook Lee, Young-Hee Song, Gu-Sung Kim | 2010-11-02 |
| 7786594 | Wafer level stack structure for system-in-package and method thereof | Kang-Wook Lee, Young-Hee Song, Gu-Sung Kim | 2010-08-31 |
| 7524763 | Fabrication method of wafer level chip scale packages | Soon-Bum Kim, Ung-Kwang Kim, Keum-Hee Ma, Young-Hee Song, Sung-Min Sim +2 more | 2009-04-28 |
| 7414303 | Lead on chip semiconductor package | Sang-Hyeop Lee, Jin Ho Kim, Chan-Suk Lee, Min-Keun Kwak, Sung Hwan Yoon +1 more | 2008-08-19 |
| 7253026 | Ultra-thin semiconductor package device and method for manufacturing the same | Sang-Ho Ahn | 2007-08-07 |
| 7214604 | Method of fabricating ultra thin flip-chip package | Soon-Bum Kim, Se-Young Jeong, Nam-Seog Kim | 2007-05-08 |
| 7215033 | Wafer level stack structure for system-in-package and method thereof | Kang-Wook Lee, Young-Hee Song, Gu-Sung Kim | 2007-05-08 |
| 7115483 | Stacked chip package having upper chip provided with trenches and method of manufacturing the same | Yong-Hwan Kwon, Sa-Yoon Kang | 2006-10-03 |
| 7078800 | Semiconductor package | Heung-Kyu Kwon, Min-ha Kim, Tae-Je Cho | 2006-07-18 |
| 7012325 | Ultra-thin semiconductor package device and method for manufacturing the same | Sang-Ho Ahn | 2006-03-14 |
| 6959856 | Solder bump structure and method for forming a solder bump | Nam-Seog Kim | 2005-11-01 |
| 6952050 | Semiconductor package | Heung-Kyu Kwon, Min-ha Kim, Tae-Je Cho | 2005-10-04 |
| 6943438 | Memory card having a control chip | Min Young Son, Tae-Gyeong Chung | 2005-09-13 |
| 6818998 | Stacked chip package having upper chip provided with trenches and method of manufacturing the same | Yong-Hwan Kwon, Sa-Yoon Kang | 2004-11-16 |
| 6812567 | Semiconductor package and package stack made thereof | Jin Ho Kim | 2004-11-02 |
| 6531564 | Water-soluble polymeric adhesion promoter and production method | Chan Eon Park, Sang Min Song | 2003-03-11 |
| 6455654 | Water-soluble polymeric adhesion promoter and production method | Chan Eon Park, Sang Min Song | 2002-09-24 |
| 6432746 | Method for manufacturing a chip scale package having slits formed on a substrate | Shin Kim, Hee-Guk Choi, Se Ill Kim | 2002-08-13 |
| D432096 | Semiconductor module | Jun-Young Jeon, Hai-Jeong Sohn, Young-Hee Song | 2000-10-17 |
| D432097 | Semiconductor package | Young-Hee Song, Hai-Jeong Sohn, Jun-Young Jeon | 2000-10-17 |
| 5897339 | Lead-on-chip semiconductor device package having an adhesive layer formed from liquid adhesive and method for manufacturing the same | Young Jae Song, Tae-Je Cho, Seung Ho Ahn, Min Ho Lee | 1999-04-27 |