Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7213329 | Method of forming a solder ball on a board and the board | Seung-Woo Kim, Pyeong-Wan Kim, Sang-Ho Ahn, Bo-Seong Kim, Ho-Jeong Mun +1 more | 2007-05-08 |
| 6432746 | Method for manufacturing a chip scale package having slits formed on a substrate | Shin Kim, Se Ill Kim, Se-Yong Oh | 2002-08-13 |