Issued Patents All Time
Showing 25 most recent of 48 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9293420 | Electronic device having a molding compound including a composite material | Adam D. Fogle, David S. Lehtonen | 2016-03-22 |
| 8946663 | Soft error resistant circuitry | Timothy Z. Hossain | 2015-02-03 |
| 8723321 | Copper interconnects with improved electromigration lifetime | Christy Mei-Chu Woo, Jun Zhai, Paul R. Besser, Kok Yong Yiang, Christine Hau-Riege | 2014-05-13 |
| 8384210 | Thermal interface material and semiconductor component including the thermal interface material | James Hayward | 2013-02-26 |
| 7561465 | Methods and systems for recovering data in a nonvolatile memory array | Bryan W. Hancock, Nicholas H. Tripsas | 2009-07-14 |
| 7460369 | Counterflow microchannel cooler for integrated circuits | — | 2008-12-02 |
| 7253504 | Integrated circuit package and method | Jun Zhai, Jinsu Kwon | 2007-08-07 |
| 7157131 | Prevention of counterfeit markings on semiconductor devices | John James Slevin | 2007-01-02 |
| 6844573 | Structure for minimizing hot spots in SOI device | — | 2005-01-18 |
| 6841841 | Neutron detecting device | Robert E. Likins | 2005-01-11 |
| 6806198 | Gas-assisted etch with oxygen | Rosalinda M. Ring, Susan Xia Li | 2004-10-19 |
| 6803653 | Apparatus for suppressing packaged semiconductor chip curvature while minimizing thermal impedance and maximizing speed/reliability | Robert E. Likins, Sharad M. Shah, Sidharth Sidharth, Devendra Natekar | 2004-10-12 |
| 6768198 | Method and system for removing conductive lines during deprocessing | Mohammad Massoodi | 2004-07-27 |
| 6548881 | Method and apparatus to achieve bond pad crater sensing and stepping identification in integrated circuit products | Pramod D. Patel, David Lewis, Colin Hatchard | 2003-04-15 |
| 6518661 | Apparatus for metal stack thermal management in semiconductor devices | Glen Gilfeather | 2003-02-11 |
| 6495393 | Method to improve chip scale package electrostatic discharge performance and suppress marking artifacts | Colin Hatchard, Ian Morgan | 2002-12-17 |
| 6483337 | Method for achieving synchronous non-destructive latchup characterization | Scott E. Johnson | 2002-11-19 |
| 6461879 | Method and apparatus for measuring effects of packaging stresses of common IC electrical performance parameters at wafer sort | Richard C. Sidharth | 2002-10-08 |
| 6429657 | Apparatus for improving image depth resolution in a magnetic field imaging apparatus | — | 2002-08-06 |
| 6395568 | Method and apparatus for achieving bond pad crater sensing and ESD protection integrated circuit products | Colin Hatchard, Ian Morgan, Michael Fliesler | 2002-05-28 |
| 6373126 | Method for reducing IC package delamination by use of internal baffles | Pramod D. Patel | 2002-04-16 |
| 6362524 | Edge seal ring for copper damascene process and method for fabrication thereof | Kurt Taylor, David C. Greenlaw | 2002-03-26 |
| 6348356 | Method and apparatus for determining the robustness of memory cells to alpha-particle/cosmic ray induced soft errors | Sunil N. Shabde, Donald L. Wollesen | 2002-02-19 |
| 6339728 | Method for marking semiconductor device using a green laser | Quang D. Nguyen | 2002-01-15 |
| 6331735 | Method to improve chip scale package electrostatic discharge performance and suppress marking artifacts | Colin Hatchard, Ian Morgan | 2001-12-18 |