Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 6548881 | Method and apparatus to achieve bond pad crater sensing and stepping identification in integrated circuit products | Richard C. Blish, II, David Lewis, Colin Hatchard | 2003-04-15 | $2,272,000 |
| 6373126 | Method for reducing IC package delamination by use of internal baffles | Richard C. Blish, II | 2002-04-16 | $2,231,000 |