Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method for reducing IC package delamination by use of internal baffles

Method for reducing IC package delamination by use of internal baffles

US Patent 6373126 · Granted Apr 16, 2002

Estimated economic value: $2,231,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Electronic device having a molding compound including a composite material2016
Soft error resistant circuitry2015
Copper interconnects with improved electromigration lifetime2014
Thermal interface material and semiconductor component including the thermal int2013
Methods and systems for recovering data in a nonvolatile memory array2009
Counterflow microchannel cooler for integrated circuits2008
Integrated circuit package and method2007
Prevention of counterfeit markings on semiconductor devices2007
Structure for minimizing hot spots in SOI device2005
Neutron detecting device2005
Gas-assisted etch with oxygen2004
Apparatus for suppressing packaged semiconductor chip curvature while minimizing2004