| 6548881 |
Method and apparatus to achieve bond pad crater sensing and stepping identification in integrated circuit products |
Richard C. Blish, II, Pramod D. Patel, David Lewis |
2003-04-15 |
| 6495393 |
Method to improve chip scale package electrostatic discharge performance and suppress marking artifacts |
Richard C. Blish, II, Ian Morgan |
2002-12-17 |
| 6395568 |
Method and apparatus for achieving bond pad crater sensing and ESD protection integrated circuit products |
Richard C. Blish, II, Ian Morgan, Michael Fliesler |
2002-05-28 |
| 6331735 |
Method to improve chip scale package electrostatic discharge performance and suppress marking artifacts |
Richard C. Blish, II, Ian Morgan |
2001-12-18 |
| 6320266 |
Technique for reducing breakage of thinned flip-chip multi-layer integrated circuit devices |
— |
2001-11-20 |
| 6315936 |
Encapsulation method using non-homogeneous molding compound pellets |
J. Courtney Black, Richard C. Blish, II |
2001-11-13 |
| 6181017 |
System for marking electrophoretic dies while reducing damage due to electrostatic discharge |
Richard C. Blish, II, Daniel Yim |
2001-01-30 |
| 6091157 |
Method to improve internal package delamination and wire bond reliability using non-homogeneous molding compound pellets |
J. Courtney Black, Richard C. Blish, II |
2000-07-18 |
| 6049465 |
Signal carrying means including a carrier substrate and wire bonds for carrying signals between the cache and logic circuitry of a microprocessor |
Richard C. Blish, II, David Lewis |
2000-04-11 |
| 6046507 |
Electrophoretic coating methodology to improve internal package delamination and wire bond reliability |
Richard C. Blish, II |
2000-04-04 |