Colin Hatchard — 10 Patents at AMD

Colin Hatchard has been granted 10 US patents while listed as an inventor at AMD. The first was granted in 2000 and the most recent in April 2003. Colin Hatchard ranks #481,000 of 4,157,543 US inventors in our database (top 11.6%). Patent records list Colin Hatchard in Campbell, CA, US.

Patents per Year

Issued Patents All Time

Showing 1–10 of 10 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
6548881	Method and apparatus to achieve bond pad crater sensing and stepping identification in integrated circuit products	Richard C. Blish, II, Pramod D. Patel, David Lewis	2003-04-15	$2,272,000
6495393	Method to improve chip scale package electrostatic discharge performance and suppress marking artifacts	Richard C. Blish, II, Ian Morgan	2002-12-17	$3,175,000
6395568	Method and apparatus for achieving bond pad crater sensing and ESD protection integrated circuit products	Richard C. Blish, II, Ian Morgan, Michael Fliesler	2002-05-28	$2,985,000
6331735	Method to improve chip scale package electrostatic discharge performance and suppress marking artifacts	Richard C. Blish, II, Ian Morgan	2001-12-18	$8,747,000
6320266	Technique for reducing breakage of thinned flip-chip multi-layer integrated circuit devices	—	2001-11-20	$3,380,000
6315936	Encapsulation method using non-homogeneous molding compound pellets	J. Courtney Black, Richard C. Blish, II	2001-11-13	$7,839,000
6181017	System for marking electrophoretic dies while reducing damage due to electrostatic discharge	Richard C. Blish, II, Daniel Yim	2001-01-30	$6,431,000
6091157	Method to improve internal package delamination and wire bond reliability using non-homogeneous molding compound pellets	J. Courtney Black, Richard C. Blish, II	2000-07-18	$10,732,000
6049465	Signal carrying means including a carrier substrate and wire bonds for carrying signals between the cache and logic circuitry of a microprocessor	Richard C. Blish, II, David Lewis	2000-04-11	$13,721,000
6046507	Electrophoretic coating methodology to improve internal package delamination and wire bond reliability	Richard C. Blish, II	2000-04-04	$6,962,000

Colin Hatchard — 10 Patents

Patents per Year

Issued Patents All Time

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