Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6548881 | Method and apparatus to achieve bond pad crater sensing and stepping identification in integrated circuit products | Richard C. Blish, II, Pramod D. Patel, David Lewis | 2003-04-15 |
| 6495393 | Method to improve chip scale package electrostatic discharge performance and suppress marking artifacts | Richard C. Blish, II, Ian Morgan | 2002-12-17 |
| 6395568 | Method and apparatus for achieving bond pad crater sensing and ESD protection integrated circuit products | Richard C. Blish, II, Ian Morgan, Michael Fliesler | 2002-05-28 |
| 6331735 | Method to improve chip scale package electrostatic discharge performance and suppress marking artifacts | Richard C. Blish, II, Ian Morgan | 2001-12-18 |
| 6320266 | Technique for reducing breakage of thinned flip-chip multi-layer integrated circuit devices | — | 2001-11-20 |
| 6315936 | Encapsulation method using non-homogeneous molding compound pellets | J. Courtney Black, Richard C. Blish, II | 2001-11-13 |
| 6181017 | System for marking electrophoretic dies while reducing damage due to electrostatic discharge | Richard C. Blish, II, Daniel Yim | 2001-01-30 |
| 6091157 | Method to improve internal package delamination and wire bond reliability using non-homogeneous molding compound pellets | J. Courtney Black, Richard C. Blish, II | 2000-07-18 |
| 6049465 | Signal carrying means including a carrier substrate and wire bonds for carrying signals between the cache and logic circuitry of a microprocessor | Richard C. Blish, II, David Lewis | 2000-04-11 |
| 6046507 | Electrophoretic coating methodology to improve internal package delamination and wire bond reliability | Richard C. Blish, II | 2000-04-04 |