Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 6770938 | Diode fabrication for ESD/EOS protection | Michael Fliesler, Mark T. Ramsbey, Mark Randolph, Timothy Thurgate, Paohua Kuo +1 more | 2004-08-03 | $1,898,000 |
| 6495393 | Method to improve chip scale package electrostatic discharge performance and suppress marking artifacts | Richard C. Blish, II, Colin Hatchard | 2002-12-17 | $3,175,000 |
| 6395568 | Method and apparatus for achieving bond pad crater sensing and ESD protection integrated circuit products | Richard C. Blish, II, Colin Hatchard, Michael Fliesler | 2002-05-28 | $2,985,000 |
| 6331735 | Method to improve chip scale package electrostatic discharge performance and suppress marking artifacts | Richard C. Blish, II, Colin Hatchard | 2001-12-18 | $8,747,000 |
| 4961444 | Clamp assemblies | Sean McAvoy | 1990-10-09 | $5,844,000 |