| 7088852 |
Three-dimensional tomography |
Michael R. Bruce, Victoria J. Bruce |
2006-08-08 |
$20,246,000 |
| 6897664 |
Laser beam induced phenomena detection |
Michael R. Bruce, Gregory A. Dabney, Palaniappan Muthupalaniappan, Jiann Min Chin, Richard Wilcox +6 more |
2005-05-24 |
$6,015,000 |
| 6844928 |
Fiber optic semiconductor analysis arrangement and method therefor |
Srikar V. Chunduri, Brennan V. Davis, David H. Eppes, Victoria J. Bruce, Michael R. Bruce +2 more |
2005-01-18 |
$6,792,000 |
| 6833718 |
Photon beacon |
David Alan Bethke, Michael R. Bruce, Shawn M. McBride, Greg Dabney, Rama R. Goruganthu |
2004-12-21 |
$5,396,000 |
| 6716683 |
Optical analysis for SOI integrated circuits |
Michael R. Bruce, Rama R. Goruganthu, Jiann Min Chin, Shawn M. McBride |
2004-04-06 |
$3,021,000 |
| 6700659 |
Semiconductor analysis arrangement and method therefor |
Srikar V. Chunduri, Brennan V. Davis, David H. Eppes, Victoria J. Bruce, Michael R. Bruce +2 more |
2004-03-02 |
$3,635,000 |
| 6661246 |
Constant-current VDDQ testing of integrated circuits |
— |
2003-12-09 |
$2,702,000 |
| 6635839 |
Semiconductor analysis arrangement and method therefor |
Srikar V. Chunduri, Brennan V. Davis, David H. Eppes, Victoria J. Bruce, Michael R. Bruce +2 more |
2003-10-21 |
$8,084,000 |
| 6566888 |
Repair of resistive electrical connections in an integrated circuit |
Michael R. Bruce, Rama R. Goruganthu |
2003-05-20 |
$2,116,000 |
| 6518661 |
Apparatus for metal stack thermal management in semiconductor devices |
Richard C. Blish, II |
2003-02-11 |
$2,033,000 |
| 6469529 |
Time-resolved emission microscopy system |
Michael R. Bruce, Rama R. Goruganthu |
2002-10-22 |
$2,399,000 |
| 6455334 |
Probe grid for integrated circuit analysis |
Rama R. Goruganthu, Jeffrey D. Birdsley, Michael R. Bruce, Brennan V. Davis, Rosalinda M. Ring |
2002-09-24 |
$1,057,000 |
| 6372627 |
Method and arrangement for characterization of focused-ion-beam insulator deposition |
Rosalinda M. Ring, Susan Xia Li |
2002-04-16 |
$2,231,000 |
| 6352871 |
Probe grid for integrated circuit excitation |
Rama R. Goruganthu, Jeffrey D. Birdsley, Michael R. Bruce, Brennan V. Davis, Rosalinda M. Ring |
2002-03-05 |
$11,927,000 |
| 6285036 |
Endpoint detection for thinning of silicon of a flip chip bonded integrated circuit |
Rama R. Goruganthu, Victoria J. Bruce |
2001-09-04 |
$3,567,000 |
| 6171944 |
Method for bringing up lower level metal nodes of multi-layered integrated circuits for signal acquisition |
Xia Li |
2001-01-09 |
$4,016,000 |
| 6069366 |
Endpoint detection for thinning of silicon of a flip chip bonded integrated circuit |
Rama R. Goruganthu, Victoria J. Bruce |
2000-05-30 |
$15,533,000 |
| 5972725 |
Device analysis for face down chip |
Donald L. Wollesen |
1999-10-26 |
$1,975,000 |
| 4870530 |
Electrostatic discharge protection circuitry for any two external pins of an I.C. package |
Roger S. Hurst |
1989-09-26 |
$3,563,000 |
| 4819047 |
Protection system for CMOS integrated circuits |
Joe W. Peterson |
1989-04-04 |
$2,363,000 |
