Issued Patents All Time
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7088852 | Three-dimensional tomography | Michael R. Bruce, Victoria J. Bruce | 2006-08-08 |
| 6897664 | Laser beam induced phenomena detection | Michael R. Bruce, Gregory A. Dabney, Palaniappan Muthupalaniappan, Jiann Min Chin, Richard Wilcox +6 more | 2005-05-24 |
| 6844928 | Fiber optic semiconductor analysis arrangement and method therefor | Srikar V. Chunduri, Brennan V. Davis, David H. Eppes, Victoria J. Bruce, Michael R. Bruce +2 more | 2005-01-18 |
| 6833718 | Photon beacon | David Alan Bethke, Michael R. Bruce, Shawn M. McBride, Greg Dabney, Rama R. Goruganthu | 2004-12-21 |
| 6716683 | Optical analysis for SOI integrated circuits | Michael R. Bruce, Rama R. Goruganthu, Jiann Min Chin, Shawn M. McBride | 2004-04-06 |
| 6700659 | Semiconductor analysis arrangement and method therefor | Srikar V. Chunduri, Brennan V. Davis, David H. Eppes, Victoria J. Bruce, Michael R. Bruce +2 more | 2004-03-02 |
| 6661246 | Constant-current VDDQ testing of integrated circuits | — | 2003-12-09 |
| 6635839 | Semiconductor analysis arrangement and method therefor | Srikar V. Chunduri, Brennan V. Davis, David H. Eppes, Victoria J. Bruce, Michael R. Bruce +2 more | 2003-10-21 |
| 6566888 | Repair of resistive electrical connections in an integrated circuit | Michael R. Bruce, Rama R. Goruganthu | 2003-05-20 |
| 6518661 | Apparatus for metal stack thermal management in semiconductor devices | Richard C. Blish, II | 2003-02-11 |
| 6469529 | Time-resolved emission microscopy system | Michael R. Bruce, Rama R. Goruganthu | 2002-10-22 |
| 6455334 | Probe grid for integrated circuit analysis | Rama R. Goruganthu, Jeffrey D. Birdsley, Michael R. Bruce, Brennan V. Davis, Rosalinda M. Ring | 2002-09-24 |
| 6372627 | Method and arrangement for characterization of focused-ion-beam insulator deposition | Rosalinda M. Ring, Susan Xia Li | 2002-04-16 |
| 6352871 | Probe grid for integrated circuit excitation | Rama R. Goruganthu, Jeffrey D. Birdsley, Michael R. Bruce, Brennan V. Davis, Rosalinda M. Ring | 2002-03-05 |
| 6285036 | Endpoint detection for thinning of silicon of a flip chip bonded integrated circuit | Rama R. Goruganthu, Victoria J. Bruce | 2001-09-04 |
| 6171944 | Method for bringing up lower level metal nodes of multi-layered integrated circuits for signal acquisition | Xia Li | 2001-01-09 |
| 6069366 | Endpoint detection for thinning of silicon of a flip chip bonded integrated circuit | Rama R. Goruganthu, Victoria J. Bruce | 2000-05-30 |
| 5972725 | Device analysis for face down chip | Donald L. Wollesen | 1999-10-26 |
| 4870530 | Electrostatic discharge protection circuitry for any two external pins of an I.C. package | Roger S. Hurst | 1989-09-26 |
| 4819047 | Protection system for CMOS integrated circuits | Joe W. Peterson | 1989-04-04 |