| 10012692 |
Precision probe positioning for at-speed integrated circuit testing using through silicon in-circuit logic analysis |
Larry Ross |
2018-07-03 |
|
| 9714978 |
At-speed integrated circuit testing using through silicon in-circuit logic analysis |
Larry Ross |
2017-07-25 |
|
| 8519391 |
Semiconductor chip with backside conductor structure |
Liang-Wei Wang |
2013-08-27 |
$3,330,000 |
| 8232586 |
Silicon photon detector |
Ronald M. Potok, Rama R. Goruganthu |
2012-07-31 |
$3,897,000 |
| 8187772 |
Solid immersion lens lithography |
Rama R. Goruganthu |
2012-05-29 |
$10,485,000 |
| 8048689 |
Semiconductor chip with backside conductor structure |
Liang-Wei Wang |
2011-11-01 |
$1,838,000 |
| 7272010 |
Thermally conductive integrated circuit mounting structures |
Miguel Santana, Jr., Thomas Chu, Rama R. Goruganthu, Robert Powell |
2007-09-18 |
$10,707,000 |
| 7235800 |
Electrical probing of SOI circuits |
Rama R. Goruganthu |
2007-06-26 |
$10,288,000 |
| 7196800 |
Semiconductor die analysis as a function of optical reflections from the die |
Jeffrey D. Birdsley, Rama R. Goruganthu |
2007-03-27 |
$8,823,000 |
| 7088852 |
Three-dimensional tomography |
Victoria J. Bruce, Glen Gilfeather |
2006-08-08 |
$20,246,000 |
| 7062399 |
Resistivity analysis |
Victoria J. Bruce, Rosalinda M. Ring, Edward Jr. I. Cole, Charles F. Hawkins, Paiboon Tangyungong |
2006-06-13 |
$11,852,000 |
| 7019511 |
Optical analysis of integrated circuits |
Jeffrey D. Birdsley, Brennan V. Davis, Rosalinda M. Ring, Daniel L. Stone |
2006-03-28 |
$11,294,000 |
| 6994584 |
Thermally conductive integrated circuit mounting structures |
Miguel Santana, Jr., Thomas Chu, Rama R. Goruganthu, Robert Powell |
2006-02-07 |
$12,481,000 |
| 6992773 |
Dual-differential interferometry for silicon device damage detection |
Rama R. Goruganthu |
2006-01-31 |
$15,487,000 |
| 6956385 |
Integrated circuit defect analysis using liquid crystal |
David H. Eppes |
2005-10-18 |
$5,936,000 |
| 6897664 |
Laser beam induced phenomena detection |
Gregory A. Dabney, Palaniappan Muthupalaniappan, Jiann Min Chin, Richard Wilcox, Glen Gilfeather +6 more |
2005-05-24 |
$6,015,000 |
| 6894518 |
Circuit analysis and manufacture using electric field-induced effects |
Rama R. Goruganthu |
2005-05-17 |
$3,810,000 |
| 6891390 |
Circuit analysis using electric field-induced effects |
Rama R. Goruganthu |
2005-05-10 |
$7,763,000 |
| 6873166 |
Localized heating for defect isolation during die operation |
Richard W. Johnson, Rama R. Goruganthu |
2005-03-29 |
$4,814,000 |
| 6870379 |
Indirect stimulation of an integrated circuit die |
Brennan V. Davis, Victoria J. Bruce, Rosalinda M. Ring, David H. Eppes |
2005-03-22 |
$6,839,000 |
| 6864972 |
IC die analysis via back side lens |
Jeffrey D. Birdsley, Brennan V. Davis, Rosalinda M. Ring, Daniel L. Stone |
2005-03-08 |
$6,020,000 |
| 6850081 |
Semiconductor die analysis via fiber optic communication |
Jeffrey D. Birdsley, Brennan V. Davis, Rosalinda M. Ring, Daniel L. Stone |
2005-02-01 |
$6,992,000 |
| 6844928 |
Fiber optic semiconductor analysis arrangement and method therefor |
Glen Gilfeather, Srikar V. Chunduri, Brennan V. Davis, David H. Eppes, Victoria J. Bruce +2 more |
2005-01-18 |
$6,792,000 |
| 6836132 |
High resolution heat exchange |
David H. Eppes, Rama R. Goruganthu |
2004-12-28 |
$7,308,000 |
| 6833716 |
Electro-optical analysis of integrated circuits |
Rama R. Goruganthu, Greg Dabney |
2004-12-21 |
$5,396,000 |
