Issued Patents All Time
Showing 25 most recent of 81 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10012692 | Precision probe positioning for at-speed integrated circuit testing using through silicon in-circuit logic analysis | Larry Ross | 2018-07-03 |
| 9714978 | At-speed integrated circuit testing using through silicon in-circuit logic analysis | Larry Ross | 2017-07-25 |
| 8519391 | Semiconductor chip with backside conductor structure | Liang-Wei Wang | 2013-08-27 |
| 8232586 | Silicon photon detector | Ronald M. Potok, Rama R. Goruganthu | 2012-07-31 |
| 8187772 | Solid immersion lens lithography | Rama R. Goruganthu | 2012-05-29 |
| 8048689 | Semiconductor chip with backside conductor structure | Liang-Wei Wang | 2011-11-01 |
| 7272010 | Thermally conductive integrated circuit mounting structures | Miguel Santana, Jr., Thomas Chu, Rama R. Goruganthu, Robert Powell | 2007-09-18 |
| 7235800 | Electrical probing of SOI circuits | Rama R. Goruganthu | 2007-06-26 |
| 7196800 | Semiconductor die analysis as a function of optical reflections from the die | Jeffrey D. Birdsley, Rama R. Goruganthu | 2007-03-27 |
| 7088852 | Three-dimensional tomography | Victoria J. Bruce, Glen Gilfeather | 2006-08-08 |
| 7062399 | Resistivity analysis | Victoria J. Bruce, Rosalinda M. Ring, Edward Jr. I. Cole, Charles F. Hawkins, Paiboon Tangyungong | 2006-06-13 |
| 7019511 | Optical analysis of integrated circuits | Jeffrey D. Birdsley, Brennan V. Davis, Rosalinda M. Ring, Daniel L. Stone | 2006-03-28 |
| 6994584 | Thermally conductive integrated circuit mounting structures | Miguel Santana, Jr., Thomas Chu, Rama R. Goruganthu, Robert Powell | 2006-02-07 |
| 6992773 | Dual-differential interferometry for silicon device damage detection | Rama R. Goruganthu | 2006-01-31 |
| 6956385 | Integrated circuit defect analysis using liquid crystal | David H. Eppes | 2005-10-18 |
| 6897664 | Laser beam induced phenomena detection | Gregory A. Dabney, Palaniappan Muthupalaniappan, Jiann Min Chin, Richard Wilcox, Glen Gilfeather +6 more | 2005-05-24 |
| 6894518 | Circuit analysis and manufacture using electric field-induced effects | Rama R. Goruganthu | 2005-05-17 |
| 6891390 | Circuit analysis using electric field-induced effects | Rama R. Goruganthu | 2005-05-10 |
| 6873166 | Localized heating for defect isolation during die operation | Richard W. Johnson, Rama R. Goruganthu | 2005-03-29 |
| 6870379 | Indirect stimulation of an integrated circuit die | Brennan V. Davis, Victoria J. Bruce, Rosalinda M. Ring, David H. Eppes | 2005-03-22 |
| 6864972 | IC die analysis via back side lens | Jeffrey D. Birdsley, Brennan V. Davis, Rosalinda M. Ring, Daniel L. Stone | 2005-03-08 |
| 6850081 | Semiconductor die analysis via fiber optic communication | Jeffrey D. Birdsley, Brennan V. Davis, Rosalinda M. Ring, Daniel L. Stone | 2005-02-01 |
| 6844928 | Fiber optic semiconductor analysis arrangement and method therefor | Glen Gilfeather, Srikar V. Chunduri, Brennan V. Davis, David H. Eppes, Victoria J. Bruce +2 more | 2005-01-18 |
| 6836132 | High resolution heat exchange | David H. Eppes, Rama R. Goruganthu | 2004-12-28 |
| 6833716 | Electro-optical analysis of integrated circuits | Rama R. Goruganthu, Greg Dabney | 2004-12-21 |