Issued Patents All Time
Showing 25 most recent of 78 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12322601 | Alternating hardmasks for tight-pitch line formation | Sean D. Burns, Chi-Chun Liu, Yann Mignot, Stuart A. Sieg | 2025-06-03 |
| 12310100 | Dielectric reflow for boundary control | Jing Guo, Ekmini Anuja De Silva, Nicolas Loubet, Indira Seshadri, Ruqiang Bao | 2025-05-20 |
| 12261044 | Multi-layer hardmask for defect reduction in EUV patterning | Bhaskar Nagabhirava, Phillip Friddle, Ekimini Anuja De Silva, Jennifer Church, Dominik Metzler | 2025-03-25 |
| 12106963 | Self aligned pattern formation post spacer etchback in tight pitch configurations | Sean D. Burns, Lawrence A. Clevenger, Matthew E. Colburn, Sivananda K. Kanakasabapathy, Christopher J. Penny +2 more | 2024-10-01 |
| 12021135 | Bottom source/drain etch with fin-cut-last-VTFET | Tao Li, Indira Seshadri, Eric R. Miller | 2024-06-25 |
| 12019376 | Polymer brush adhesion promoter with UV cleavable linker | Jing Guo, Bharat Kumar, Ekmini Anuja De Silva, Jennifer Church, Dario L. Goldfarb | 2024-06-25 |
| 11804401 | Spacer-defined process for lithography-etch double patterning for interconnects | Ekmini Anuja De Silva, Luciana Meli Thompson, Yann Mignot | 2023-10-31 |
| 11699592 | Inverse tone pillar printing method using organic planarizing layer pillars | Ekmini Anuja De Silva, Praveen Joseph, Ashim Dutta | 2023-07-11 |
| 11695059 | Bottom source/drain etch with fin-cut-last-VTFET | Tao Li, Indira Seshadri, Eric R. Miller | 2023-07-04 |
| 11682558 | Fabrication of back-end-of-line interconnects | Chi-Chun Liu, Ashim Dutta, Ekmini Anuja De Silva | 2023-06-20 |
| 11681213 | EUV pattern transfer using graded hardmask | Luciana Meli Thompson, Ashim Dutta, Ekmini Anuja De Silva | 2023-06-20 |
| 11670510 | Self aligned pattern formation post spacer etchback in tight pitch configurations | Sean D. Burns, Lawrence A. Clevenger, Matthew E. Colburn, Sivananda K. Kanakasabapathy, Christopher J. Penny +2 more | 2023-06-06 |
| 11646221 | Self-aligned pattern formation for a semiconductor device | Sean D. Burns, Lawrence A. Clevenger, Sivananda K. Kanakasabapathy, Christopher J. Penny, Nicole Saulnier | 2023-05-09 |
| 11610780 | Alternating hardmasks for tight-pitch line formation | Sean D. Burns, Chi-Chun Liu, Yann Mignot, Stuart A. Sieg | 2023-03-21 |
| 11543751 | Organic photoresist adhesion to metal oxide hardmasks | Abraham Arceo de la Pena, Jennifer Church, Ekmini Anuja De Silva | 2023-01-03 |
| 11515431 | Enabling residue free gap fill between nanosheets | Indira Seshadri, Ekmini Anuja De Silva, Jing Guo, Ruqiang Bao, Muthumanickam Sankarapandian | 2022-11-29 |
| 11500293 | Patterning material film stack with hard mask layer configured to support selective deposition on patterned resist layer | Ekmini Anuja De Silva, Indira Seshadri, Jing Guo, Ashim Dutta | 2022-11-15 |
| 11302573 | Semiconductor structure with fully aligned vias | Ekmini Anuja De Silva, Ashim Dutta, Praveen Joseph | 2022-04-12 |
| 11300881 | Line break repairing layer for extreme ultraviolet patterning stacks | Luciana Meli Thompson, Jing Guo, Ekmini Anuja De Silva | 2022-04-12 |
| 11245027 | Bottom source/drain etch with fin-cut-last-VTFET | Tao Li, Indira Seshadri, Eric R. Miller | 2022-02-08 |
| 11239077 | Litho-etch-litho-etch with self-aligned blocks | Chi-Chun Liu, Yann Mignot, Ekmini Anuja De Silva, John C. Arnold, Allen H. Gabor | 2022-02-01 |
| 11227793 | Self-aligned pattern formation for a semiconductor device | Sean D. Burns, Lawrence A. Clevenger, Sivananda K. Kanakasabapathy, Christopher J. Penny, Nicole Saulnier | 2022-01-18 |
| 11226561 | Self-priming resist for generic inorganic hardmasks | Chi-Chun Liu, Indira Seshadri, Kristin Schmidt, Daniel P. Sanders, Jing Guo +2 more | 2022-01-18 |
| 11199778 | Polymer brush adhesion promoter with UV cleavable linker | Jing Guo, Bharat Kumar, Ekmini Anuja De Silva, Jennifer Church, Dario L. Goldfarb | 2021-12-14 |
| 11192101 | Method to create multilayer microfluidic chips using spin-on carbon as gap filling materials | Chi-Chun Liu, Yann Mignot, Joshua T. Smith, Bassem M. Hamieh, Robert L. Bruce | 2021-12-07 |