Issued Patents All Time
Showing 1–25 of 50 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10944044 | MRAM structure with T-shaped bottom electrode to overcome galvanic effect | Pouya Hashemi, Bruce B. Doris, Eugene J. O'Sullivan | 2021-03-09 |
| 10727121 | Thin film interconnects with large grains | Robert L. Bruce, Cyril Cabral, Jr., Gregory M. Fritz, Eric A. Joseph, Hiroyuki Miyazoe +2 more | 2020-07-28 |
| 10644233 | Combined CMP and RIE contact scheme for MRAM applications | Nathan P. Marchack, Janusz J. Nowak, Eugene J. O'Sullivan | 2020-05-05 |
| 10247700 | Embedded noble metal electrodes in microfluidics | Huan Hu, Joshua T. Smith, Benjamin H. Wunsch, Daniel J. Solis | 2019-04-02 |
| 10236443 | Combined CMP and RIE contact scheme for MRAM applications | Nathan P. Marchack, Janusz J. Nowak, Eugene J. O'Sullivan | 2019-03-19 |
| 10170361 | Thin film interconnects with large grains | Robert L. Bruce, Cyril Cabral, Jr., Gregory M. Fritz, Eric A. Joseph, Hiroyuki Miyazoe +2 more | 2019-01-01 |
| 10014464 | Combined CMP and RIE contact scheme for MRAM applications | Nathan P. Marchack, Janusz J. Nowak, Eugene J. O'Sullivan | 2018-07-03 |
| 9914118 | Nanogap structure for micro/nanofluidic systems formed by sacrificial sidewalls | Yann Astier, Markus Brink, Joshua T. Smith | 2018-03-13 |
| 9804122 | Embedded noble metal electrodes in microfluidics | Huan Hu, Joshua T. Smith, Daniel J. Solis, Benjamin H. Wunsch | 2017-10-31 |
| 9782773 | Nanogap structure for micro/nanofluidic systems formed by sacrificial sidewalls | Yann Astier, Markus Brink, Joshua T. Smith | 2017-10-10 |
| 9012329 | Nanogap in-between noble metals | Yann Astier, Jingwei Bai, Satyavolu S. Papa Rao, Joshua T. Smith, Chao Wang | 2015-04-21 |
| 8807318 | Multi-generational carrier platform | — | 2014-08-19 |
| 8794427 | Multi-generational carrier platform | — | 2014-08-05 |
| 8591289 | Multi-spindle chemical mechanical planarization tool | Michael A. Cobb, Mahadevaiyer Krishnan, Dennis G. Manzer | 2013-11-26 |
| 8535118 | Multi-spindle chemical mechanical planarization tool | Michael A. Cobb, Mahadevaiyer Krishnan, Dennis G. Manzer | 2013-09-17 |
| 8524606 | Chemical mechanical planarization with overburden mask | Leslie M. Charns, John M. Cotte, Jason E. Cummings, Lukasz J. Hupka, Dinesh R. Koli +6 more | 2013-09-03 |
| 8513127 | Chemical mechanical planarization processes for fabrication of FinFET devices | Josephine B. Chang, Leslie M. Charns, Jason E. Cummings, Michael A. Guillorn, Lukasz J. Hupka +7 more | 2013-08-20 |
| 8507383 | Fabrication of replacement metal gate devices | Takashi Ando, Leslie M. Charns, Jason E. Cummings, Lukasz J. Hupka, Dinesh R. Koli +6 more | 2013-08-13 |
| 8497210 | Shallow trench isolation chemical mechanical planarization | Leslie M. Charns, Jason E. Cummings, Lukasz J. Hupka, Dinesh R. Koli, Tomohisa Konno +5 more | 2013-07-30 |
| 8445313 | Method for forming a self-aligned bit line for PCRAM and self-aligned etch back process | Matthew J. Breitwisch, Chieh-Fang Chen, Shih-Hung Chen, Eric A. Joseph, Chung H. Lam +3 more | 2013-05-21 |
| 8273598 | Method for forming a self-aligned bit line for PCRAM and self-aligned etch back process | Matthew J. Breitwisch, Chieh-Fang Chen, Shih-Hung Chen, Eric A. Joseph, Chung H. Lam +3 more | 2012-09-25 |
| 8263497 | High-yield method of exposing and contacting through-silicon vias | Paul S. Andry, John M. Cotte, Edmund J. Sprogis, James A. Tornello, Cornelia K. Tsang | 2012-09-11 |
| 7955160 | Glass mold polishing method and structure | Michael A. Cobb, Dinesh R. Koli, Dennis G. Manzer, Paraneetha Poloju, James A. Tornello | 2011-06-07 |
| 7442647 | Structure and method for formation of cladded interconnects for MRAMs | Sivananda K. Kanakasabapathy, Eugene J. O'Sullivan, Michael C. Gaidis | 2008-10-28 |
| 7179760 | Bilayer cap structure including HDP/bHDP films for conductive metallization and method of making same | Richard A. Conti, Thomas Houghton, Jeffery B. Maxson, Ann McDonald, Yun-Yu Wang +2 more | 2007-02-20 |