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Multi integrated circuit chip carrier package |
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Managing thermal warpage of a laminate |
Charles L. Arvin, Thomas E. Lombardi, Hilton T. Toy, Krishna R. Tunga, Thomas Weiss |
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Heterogeneous thermal interface material for corner and or edge degradation mitigation |
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| 10541156 |
Multi integrated circuit chip carrier package |
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Yi Pan, Hilton T. Toy, Jeffrey A. Zitz |
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Thermal hot spot cooling for semiconductor devices |
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3D bond and assembly process for severely bowed interposer die |
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Electronic module assembly with patterned adhesive array |
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Uniform solder reflow fixture |
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