Issued Patents All Time
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12431416 | Chip package with integrated current control | Chun-Yuan Cheng, Chao-Chin Lee | 2025-09-30 |
| 12354978 | Coupled loop and void structure integrated in a redistribution layer of a chip package | Po-Wei Chiu, Tzu-No Chen, Hong Shi, Young-Soo Lee | 2025-07-08 |
| 12355000 | Package comprising a substrate and a high-density interconnect integrated device | Yangyang SUN, Zhimin Song | 2025-07-08 |
| 12136613 | Chip package with near-die integrated passive device | Suresh Ramalingam, Hong Shi | 2024-11-05 |
| 11784157 | Package comprising integrated devices coupled through a metallization layer | Charles David Paynter, Ryan David Lane, Jianwen Xu, William Stone | 2023-10-10 |
| 11676922 | Integrated device comprising interconnect structures having an inner interconnect, a dielectric layer and a conductive layer | Yue Li, Yangyang SUN | 2023-06-13 |
| 11605594 | Package comprising a substrate and a high-density interconnect integrated device coupled to the substrate | Ryan David Lane, Charles David Paynter, Eric David Foronda | 2023-03-14 |
| 11594491 | Multi-die interconnect | Hong Bok We | 2023-02-28 |
| 11380613 | Repurposed seed layer for high frequency noise control and electrostatic discharge connection | Yue Li, Yangyang SUN | 2022-07-05 |
| 11189574 | Microelectronic package having electromagnetic interference shielding | Chung-Hao Chen, James C. Matayabas, Jr., Min Keen Tang | 2021-11-30 |
| 11139224 | Package comprising a substrate having a via wall configured as a shield | Chaoqi Zhang, Rajneesh Kumar, Darryl Sheldon JESSIE, Suhyung Hwang, Jeahyeong Han +2 more | 2021-10-05 |
| 10910314 | Conductive coating for a microelectronics package | Chung-Hao Chen, Emile Davies-Venn, Kemal Aygun, Mitul Modi | 2021-02-02 |
| 10658198 | Solder resist layer structures for terminating de-featured components and methods of making the same | Chi-Te Chen, Wei-Lun Kane Jen, Olivia Chen, Yun Ling | 2020-05-19 |
| 10510667 | Conductive coating for a microelectronics package | Chung-Hao Chen, Emile Davies-Venn, Kemal Aygun, Mitul Modi | 2019-12-17 |
| 10244632 | Solder resist layer structures for terminating de-featured components and methods of making the same | Chi-Te Chen, Wei-Lun Kane Jen, Olivia Chen, Yun Ling | 2019-03-26 |
| 9900976 | Integrated circuit package including floating package stiffener | Chung-Hao Chen, Min Keen Tang | 2018-02-20 |