Issued Patents All Time
Showing 25 most recent of 32 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12356665 | Stacked transistors having an isolation region therebetween and a common gate electrode, and related fabrication methods | Seungchan Yun, Inchan Hwang, Gunho Jo, Jeonghyuk Yim, Byounghak Hong +6 more | 2025-07-08 |
| 11978668 | Integrated circuit devices including a via and methods of forming the same | Ming He, Anthony Dongick LEE, Seowoo Nam, Sang-Hoon Ahn | 2024-05-07 |
| 11769686 | Methods and apparatus for electroless plating dispense | Harinath Reddy, Christopher D. Thomas | 2023-09-26 |
| 11705363 | Fully aligned via integration with selective catalyzed vapor phase grown materials | Ming He, Rebecca Park | 2023-07-18 |
| 11537898 | Generative structure-property inverse computational co-design of materials | Ganesh Hegde | 2022-12-27 |
| 11289419 | Interconnects having long grains and methods of manufacturing the same | Jorge A. Kittl, Ganesh Hegde | 2022-03-29 |
| 11087055 | Method of screening materials using forward conducting modes | Ganesh Hegde, Chris Bowen | 2021-08-10 |
| 11043454 | Low resistivity interconnects with doped barrier layer for integrated circuits | Ganesh Hegde | 2021-06-22 |
| 10957579 | Integrated circuit devices including a via and methods of forming the same | Yung Bae Kim, Jong Hyun Lee | 2021-03-23 |
| 10916513 | Method and system for providing a reverse engineering resistant hardware embedded security module | Ganesh Hegde, Joon Goo Hong, Rwik Sengupta, Mark S. Rodder | 2021-02-09 |
| 10825723 | Semiconductor device and method for making the same | Joon Goo Hong, Mark S. Rodder | 2020-11-03 |
| 10763207 | Interconnects having long grains and methods of manufacturing the same | Jorge A. Kittl, Ganesh Hegde | 2020-09-01 |
| 10381315 | Method and system for providing a reverse-engineering resistant hardware embedded security module | Ganesh Hegde, Joon Goo Hong, Rwik Sengupta, Mark S. Rodder | 2019-08-13 |
| 9932671 | Precursor and process design for photo-assisted metal atomic layer deposition (ALD) and chemical vapor deposition (CVD) | James M. Blackwell, Patricio E. Romero, Scott B. Clendenning, Grant Kloster, Florian Gstrein +2 more | 2018-04-03 |
| 8779589 | Liner layers for metal interconnects | Daniel J. Zierath, Michael Haverty, Sadasivan Shankar | 2014-07-15 |
| 8425987 | Surface charge enhanced atomic layer deposition of pure metallic films | Juan E. Dominguez, Adrien LaVoie, John J. Plombon | 2013-04-23 |
| 8344352 | Using unstable nitrides to form semiconductor structures | Juan E. Dominguez, Adrien LaVoie, John J. Plombon, Joseph H. Han | 2013-01-01 |
| 8319287 | Tunable gate electrode work function material for transistor applications | Adrien LaVoie, Valery M. Dubin, John J. Plombon, Juan E. Dominguez, Joseph H. Han +1 more | 2012-11-27 |
| 8012878 | Atomic layer volatilization process for metal layers | Adrien LaVoie | 2011-09-06 |
| 7982204 | Using unstable nitrides to form semiconductor structures | Juan E. Dominguez, Adrien LaVoie, John J. Plombon, Joseph H. Han | 2011-07-19 |
| 7964746 | Copper precursors for CVD/ALD/digital CVD of copper metal films | Tianniu Chen, Chongying Xu, Thomas H. Baum, Bryan C. Hendrix, Jeffrey F. Roeder +2 more | 2011-06-21 |
| 7858525 | Fluorine-free precursors and methods for the deposition of conformal conductive films for nanointerconnect seed and fill | Juan E. Dominguez, Adrien LaVoie, John J. Plombon, Joseph H. Han, Bryan C. Hendrix +1 more | 2010-12-28 |
| 7851360 | Organometallic precursors for seed/barrier processes and methods thereof | Juan E. Dominguez, Adrien LaVoie, John J. Plombon, Joseph H. Han, David Thompson +1 more | 2010-12-14 |
| 7749906 | Using unstable nitrides to form semiconductor structures | Juan E. Dominguez, Adrien LaVoie, John J. Plombon, Joseph H. Han | 2010-07-06 |
| 7704895 | Deposition method for high-k dielectric materials | Adrien LaVoie, John J. Plombon, Juan E. Dominguez, Mansour Moinpour | 2010-04-27 |