Issued Patents All Time
Showing 25 most recent of 169 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12194591 | Roller for location-specific wafer polishing | Ekaterina A. Mikhaylichenko, Brian J. Brown, Chirantha Rodrigo, Steven M. Zuniga, Jay Gurusamy | 2025-01-14 |
| 12023853 | Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles | Kasiraman Krishnan, Daniel Redfield, Russell Edward Perry, Gregory E. Menk, Rajeev Bajaj +3 more | 2024-07-02 |
| 11980992 | Integrated abrasive polishing pads and manufacturing methods | Ashavani Kumar, Ashwin CHOCKALINGAM, Sivapackia Ganapathiappan, Rajeev Bajaj, Boyi Fu +6 more | 2024-05-14 |
| 11958162 | CMP pad construction with composite material properties using additive manufacturing processes | Rajeev Bajaj, Kasiraman Krishnan, Mahendra C. ORILALL, Daniel Redfield, Nag B. Patibandla +4 more | 2024-04-16 |
| 11780046 | Polishing system with annular platen or polishing pad | Paul D. Butterfield, Thomas H. Osterheld, Jeonghoon Oh, Shou-Sung Chang, Steven M. Zuniga | 2023-10-10 |
| 11511388 | Polishing system with support post and annular platen or polishing pad | Paul D. Butterfield, Thomas H. Osterheld, Jeonghoon Oh, Shou-Sung Chang, Steven M. Zuniga | 2022-11-29 |
| 11471999 | Integrated abrasive polishing pads and manufacturing methods | Ashavani Kumar, Ashwin CHOCKALINGAM, Sivapackia Ganapathiappan, Rajeev Bajaj, Boyi Fu +6 more | 2022-10-18 |
| 11446788 | Precursor formulations for polishing pads produced by an additive manufacturing process | Rajeev Bajaj, Daniel Redfield, Mahendra C. ORILALL, Boyi Fu, Ashwin CHOCKALINGAM +2 more | 2022-09-20 |
| 10875145 | Polishing pads produced by an additive manufacturing process | Rajeev Bajaj, Daniel Redfield, Mahendra C. ORILALL, Boyi Fu, Aniruddh Jagdish Khanna +12 more | 2020-12-29 |
| 10821573 | Polishing pads produced by an additive manufacturing process | Rajeev Bajaj, Daniel Redfield, Mahendra C. ORILALL, Boyi Fu, Aniruddh Jagdish Khanna +12 more | 2020-11-03 |
| 10800000 | Multi-layered nano-fibrous CMP pads | Robert D. Tolles, Mahendra C. ORILALL, Rajeev Bajaj | 2020-10-13 |
| 10786885 | Thin plastic polishing article for CMP applications | Robert D. Tolles, Gregory E. Menk, Eric Davey, You Wang, Huyen Karen Tran +3 more | 2020-09-29 |
| 10562147 | Polishing system with annular platen or polishing pad for substrate monitoring | Paul D. Butterfield, Thomas H. Osterheld, Jeonghoon Oh, Shou-Sung Chang, Steven M. Zuniga | 2020-02-18 |
| 10537974 | CMP pad construction with composite material properties using additive manufacturing processes | Rajeev Bajaj, Kasiraman Krishnan, Mahendra C. ORILALL, Daniel Redfield, Nag B. Patibandla +4 more | 2020-01-21 |
| 10493691 | Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles | Kasiraman Krishnan, Daniel Redfield, Russell Edward Perry, Gregory E. Menk, Rajeev Bajaj +3 more | 2019-12-03 |
| 10456886 | Porous chemical mechanical polishing pads | Sivapackia Ganapathiappan, Nag B. Patibandla, Rajeev Bajaj, Daniel Redfield, Mahendra C. ORILALL +3 more | 2019-10-29 |
| 10384330 | Polishing pads produced by an additive manufacturing process | Rajeev Bajaj, Daniel Redfield, Mahendra C. ORILALL, Boyi Fu, Aniruddh Jagdish Khanna +12 more | 2019-08-20 |
| 10322491 | Printed chemical mechanical polishing pad | Mahendra C. ORILALL, Timothy Michaelson, Kasiraman Krishnan, Rajeev Bajaj, Nag B. Patibandla +2 more | 2019-06-18 |
| 10199281 | Substrate features for inductive monitoring of conductive trench depth | Wei Lu, Zhihong Wang, Wen-Chiang Tu, Zhefu Wang, Hassan G. Iravani +2 more | 2019-02-05 |
| 10086500 | Method of manufacturing a UV curable CMP polishing pad | Mahendra C. ORILALL, Rajeev Bajaj | 2018-10-02 |
| 9911664 | Substrate features for inductive monitoring of conductive trench depth | Wei Lu, Zhihong Wang, Wen-Chiang Tu, Zhefu Wang, Hassan G. Iravani +2 more | 2018-03-06 |
| 9873180 | CMP pad construction with composite material properties using additive manufacturing processes | Rajeev Bajaj, Kasiraman Krishnan, Mahendra C. ORILALL, Daniel Redfield, Nag B. Patibandla +4 more | 2018-01-23 |
| 9776361 | Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles | Kasiraman Krishnan, Daniel Redfield, Russell Edward Perry, Gregory E. Menk, Rajeev Bajaj +3 more | 2017-10-03 |
| 9669512 | CMP pads having material composition that facilitates controlled conditioning | Rajeev Bajaj, Craig E. Bohn | 2017-06-06 |
| 9486893 | Conditioning of grooving in polishing pads | Hung Chih Chen, Rajeev Bajaj, Brian J. Brown, Robert Lum | 2016-11-08 |