| 10679966 |
Gallium liquid metal embrittlement for device rework |
Yolande Elodie Nguena Dongmo, Richard Langlois |
2020-06-09 |
| 10559549 |
Gallium liquid metal embrittlement for device rework |
Yolande Elodie Nguena Dongmo, Richard Langlois |
2020-02-11 |
| 8689437 |
Method for forming integrated circuit assembly |
Bing Dang, Mario J. Interrante, John U. Knickerbocker, Michael J. Shapiro, Van Thanh Truong |
2014-04-08 |
| 8162199 |
Mold shave apparatus and injection molded soldering process |
Eric E. Bourchard, Guy Paul Brouillette, Peter A. Gruber, Jean-Luc Landreville |
2012-04-24 |
| 7819376 |
Techniques for forming interconnects |
Mukta G. Farooq, Peter A. Gruber, John U. Knickerbocker, George R. Proto, Da-Yuan Shih |
2010-10-26 |
| 7348270 |
Techniques for forming interconnects |
Mukta G. Farooq, Peter A. Gruber, John U. Knickerbocker, George R. Proto, Da-Yuan Shih |
2008-03-25 |
| 7070087 |
Method and apparatus for transferring solder bumps |
Guy Paul Brouillette, Jean-Paul Henry |
2006-07-04 |
| 7038462 |
Method and apparatus for electrical commoning of circuits |
Richard Langlois, Martin Lapointe, Robert-Paul Leclerc |
2006-05-02 |
| 6832747 |
Hybrid molds for molten solder screening process |
Steven A. Cordes, Peter A. Gruber, James L. Speidell, Joseph Zinter |
2004-12-21 |
| 6566612 |
Method for direct chip attach by solder bumps and an underfill layer |
Guy Paul Brouillette, Peter A. Gruber, Michael Liehr, Carlos J. Sambucetti |
2003-05-20 |
| 6390439 |
Hybrid molds for molten solder screening process |
Steven A. Cordes, Peter A. Gruber, James L. Speidell, Joseph Zinter |
2002-05-21 |
| 6341418 |
Method for direct chip attach by solder bumps and an underfill layer |
Guy Paul Brouillette, Peter A. Gruber, Michael Liehr, Carlos J. Sambucetti |
2002-01-29 |
| 6340630 |
Method for making interconnect for low temperature chip attachment |
Daniel G. Berger, Guy Paul Brouillette, Peter A. Gruber, Bruce Lee Humphrey, Michael Liehr +2 more |
2002-01-22 |
| 6276596 |
Low temperature solder column attach by injection molded solder and structure formed |
Peter A. Gruber, Lannie R. Bolde, Guy Paul Brouillette, James H. Covell, Chon Cheong Lei |
2001-08-21 |
| 6149122 |
Method for building interconnect structures by injection molded solder and structures built |
Daniel G. Berger, Guy Paul Brouillette, Peter A. Gruber, Rajesh Shankerlal Patel, Stephen Roux +2 more |
2000-11-21 |
| 6133633 |
Method for building interconnect structures by injection molded solder and structures built |
Daniel G. Berger, Guy Paul Brouillette, Peter A. Gruber, Rajesh Shankerlal Patel, Stephen Roux +2 more |
2000-10-17 |
| 6127735 |
Interconnect for low temperature chip attachment |
Daniel G. Berger, Guy Paul Brouillette, Peter A. Gruber, Bruce Lee Humphrey, Michael Liehr +2 more |
2000-10-03 |
| 6112976 |
Method of manufacturing wire segments of homogeneous composition |
Louis-Marie Achard, Claude Blais, Jean-Francois Garneau, Michel Robert |
2000-09-05 |
| 6003757 |
Apparatus for transferring solder bumps and method of using |
Guy D. Beaumont, Guy Paul Brouillette, Peter A. Gruber |
1999-12-21 |
| 5897336 |
Direct chip attach for low alpha emission interconnect system |
Guy Paul Brouillette, Michael Liehr, William T. Motsiff, Judith Marie Roldan, Carlos J. Sambucetti +1 more |
1999-04-27 |
| 5775569 |
Method for building interconnect structures by injection molded solder and structures built |
Daniel G. Berger, Guy Paul Brouillette, Peter A. Gruber, Rajesh Shankerlal Patel, Stephen Roux +2 more |
1998-07-07 |
| 5202943 |
Optoelectronic assembly with alignment member |
Gary R. Carden, Eric M. Foster, William W. Vetter |
1993-04-13 |
