Issued Patents All Time
Showing 1–25 of 36 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10714431 | Semiconductor packages with electromagnetic interference shielding | Dzafir Bin Mohd Shariff, Seung Guen Park, Roel Adeva Robles | 2020-07-14 |
| 10658277 | Semiconductor package with a heat spreader and method of manufacturing thereof | Nataporn Charusabha, Saravuth Sirinorakul, Preecha Joymak, Roel Adeva Robles | 2020-05-19 |
| 10573590 | Multi-layer leadless semiconductor package and method of manufacturing the same | Roel Adeva Robles | 2020-02-25 |
| 9564387 | Semiconductor package having routing traces therein | Saravuth Sirinorakul, Rui Huang | 2017-02-07 |
| 9472532 | Leadframe area array packaging technology | Nathapong Suthiwongsunthorn, Yong Bo Yang | 2016-10-18 |
| 9023690 | Leadframe area array packaging technology | Nathapong Suthiwongsunthorn, Yong Bo Yang | 2015-05-05 |
| 8536689 | Integrated circuit package system with multi-surface die attach pad | Il Kwon Shim, Sheila Rima C. Magno, Dennis Guillermo | 2013-09-17 |
| 8513542 | Integrated circuit leaded stacked package system | Heap Hoe Kuan, Tsz Yin Ho, Dioscoro A. Merilo, Seng Guan Chow | 2013-08-20 |
| 8422243 | Integrated circuit package system employing a support structure with a recess | Seng Guan Chow | 2013-04-16 |
| 8421197 | Integrated circuit package system with warp-free chip | Byung Tai Do, Il Kwon Shim, Heap Hoe Kuan | 2013-04-16 |
| 8274145 | Semiconductor package system with patterned mask over thermal relief | Leocadio Morona Alabin, Librado Gatbonton, Chiu Hsieh Ong, Beng Yee Teh | 2012-09-25 |
| 8232658 | Stackable integrated circuit package system with multiple interconnect interface | Seng Guan Chow, Heap Hoe Kuan, Dioscoro A. Merilo | 2012-07-31 |
| 8178394 | Quad flat pack in quad flat pack integrated circuit package system and method for manufacturing thereof | Dioscoro A. Merilo | 2012-05-15 |
| 8174127 | Integrated circuit package system employing device stacking | Frederick R. Dahilig, Sheila Marie L. Alvarez, Dioscoro A. Merilo | 2012-05-08 |
| 8120187 | Integrated circuit package system employing device stacking and method of manufacture thereof | Frederick R. Dahilig, Sheila Marie L. Alvarez, Dioscoro A. Merilo | 2012-02-21 |
| 8106500 | Stackable integrated circuit package system | Seng Guan Chow, Heap Hoe Kuan, Dioscoro A. Merilo | 2012-01-31 |
| 7986043 | Integrated circuit package on package system | Dioscoro A. Merilo, Seng Guan Chow, Heap Hoe Kuan, Tsz Yin Ho | 2011-07-26 |
| 7981702 | Integrated circuit package in package system | Tsz Yin Ho, Dioscoro A. Merilo, Seng Guan Chow, Heap Hoe Kuan | 2011-07-19 |
| 7936055 | Integrated circuit package system with interlock | Pandi C. Marimuthu | 2011-05-03 |
| 7928540 | Integrated circuit package system | Il Kwon Shim, Henry Descalzo Bathan, Jeffrey D. Punzalan | 2011-04-19 |
| 7892894 | Method of manufacturing integrated circuit package system with warp-free chip | Byung Tai Do, Il Kwon Shim, Heap Hoe Kuan | 2011-02-22 |
| 7863108 | Integrated circuit packaging system with etched ring and die paddle and method of manufacture thereof | Il Kwon Shim, Sheila Rima C. Magno | 2011-01-04 |
| 7830020 | Integrated circuit package system employing device stacking | Frederick R. Dahilig, Sheila Marie L. Alvarez, Dioscoro A. Merilo | 2010-11-09 |
| 7777320 | Quad flat pack in quad flat pack integrated circuit package system | Dioscoro A. Merilo | 2010-08-17 |
| 7741707 | Stackable integrated circuit package system | Seng Guan Chow, Heap Hoe Kuan, Dioscoro A. Merilo | 2010-06-22 |