Issued Patents All Time
Showing 26–47 of 47 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7537954 | Microelectronic assembly having thermoelectric elements to cool a die and a method of making the same | Sarah Kim, R. Scott List, Gregory M. Chrysler | 2009-05-26 |
| 7410884 | 3D integrated circuits using thick metal for backside connections and offset bumps | Sarah Kim, Patrick Morrow | 2008-08-12 |
| 7402509 | Method of forming self-passivating interconnects and resulting devices | Mauro J. Kobrinsky, Jun He, Kevin P. O'Brien, Patrick Morrow, Ying Zhou | 2008-07-22 |
| 7358201 | Methods of forming channels on an integrated circuit die and die cooling systems including such channels | Chin-Chang Cheng, Alan M. Myers | 2008-04-15 |
| 7345479 | Portable NMR device and method for making and using the same | Chang-Min Park, Patrick Morrow, Kenneth Cadien | 2008-03-18 |
| 7320928 | Method of forming a stacked device filler | Grant Kloster, David Staintes | 2008-01-22 |
| 7319323 | Device and method using magnetic pattern on disk | Chang-Min Park, Kenneth Cadien | 2008-01-15 |
| 7307005 | Wafer bonding with highly compliant plate having filler material enclosed hollow core | Mauro J. Kobrinsky, Scott List | 2007-12-11 |
| 7274191 | Integrated on-chip NMR and ESR device and method for making and using the same | Chang-Min Park, Patrick Morrow, Kenneth Cadien | 2007-09-25 |
| 7268015 | Method for wafer stacking using copper structures of substantially uniform height | Vijayakumar Ramachandrarao | 2007-09-11 |
| 7214605 | Deposition of diffusion barrier | Grant Kloster, Patrick Morrow, Vijayakumar Ramachandrarao, Scott List | 2007-05-08 |
| 7211890 | Integrating thermoelectric elements into wafer for heat extraction | Gregory M. Chrysler, David Chau, Ryan Lei | 2007-05-01 |
| 7186637 | Method of bonding semiconductor devices | Grant Kloster, Chin-Chang Chen, Paul B. Fischer | 2007-03-06 |
| 7183648 | Method and apparatus for low temperature copper to copper bonding | Sarah Kim | 2007-02-27 |
| 7180180 | Stacked device underfill and a method of fabrication | Grant Kloster, Michael Goodner, Patrick Morrow | 2007-02-20 |
| 7118989 | Method of forming vias on a wafer stack using laser ablation | Eric J. Li | 2006-10-10 |
| 7087538 | Method to fill the gap between coupled wafers | David Staines, Grant Kloster | 2006-08-08 |
| 7038324 | Wafer stacking using interconnect structures of substantially uniform height | Vijayakumar Ramachandrarao | 2006-05-02 |
| 7034394 | Microelectronic assembly having thermoelectric elements to cool a die and a method of making the same | Sarah Kim, R. Scott List, Gregory M. Chrysler | 2006-04-25 |
| 6984873 | Method of forming a stacked device filler | Grant Kloster, David Staintes | 2006-01-10 |
| 6946384 | Stacked device underfill and a method of fabrication | Grant Kloster, Michael Goodner, Patrick Morrow | 2005-09-20 |
| 6919231 | Methods of forming channels on an integrated circuit die and die cooling systems including such channels | Chin-Chang Cheng, Alan M. Myers | 2005-07-19 |