Issued Patents All Time
Showing 51–75 of 110 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10734236 | Electronic devices with components formed by late binding using self-assembled monolayers | Fay Hua, Telesphor Kamgaing, Adel A. Elsherbini, Henning Braunisch, Johanna M. Swan | 2020-08-04 |
| 10721568 | Piezoelectric package-integrated acoustic transducer devices | Georgios Dogiamis, Feras Eid, Adel A. Elsherbini, Johanna M. Swan, Shawna M. Liff +1 more | 2020-07-21 |
| 10686250 | Cup antenna radio | James B. West | 2020-06-16 |
| 10680788 | Waveguide communication with increased link data rate | Georgios Dogiamis, Telesphor Kamgaing, Emanuel Cohen | 2020-06-09 |
| 10658566 | Piezoelectric driven switches integrated in organic, flexible displays | Shawna M. Liff, Feras Eid, Aleksandar Aleksov, Baris Bicen, Thomas L. Sounart +3 more | 2020-05-19 |
| 10649158 | Alignment of single and multi-mode optical fibers using piezoelectric actuators | Johanna M. Swan, Aleksandar Aleksov, Feras Eid, Baris Bicen, Thomas L. Sounart +2 more | 2020-05-12 |
| 10644616 | Piezoelectric package-integrated motor | Shawna M. Liff, Georgios Dogiamis, Feras Eid, Adel A. Elsherbini, Thomas L. Sounart +1 more | 2020-05-05 |
| 10636716 | Through-mold structures | Srikant Nekkanty, Joshua D. Heppner, Adel A. Elsherbini, Yoshihiro Tomita, Debendra Mallik +2 more | 2020-04-28 |
| 10634566 | Piezoelectric package-integrated temperature sensing devices | Feras Eid, Georgios Dogiamis, Thomas L. Sounart, Adel A. Elsherbini, Shawna M. Liff +1 more | 2020-04-28 |
| 10629557 | Improving mechanical and thermal reliability in varying form factors | Veronica Strong, Shawna M. Liff | 2020-04-21 |
| 10593636 | Platform with thermally stable wireless interconnects | Georgios Dogiamis, Telesphor Kamgaing, Adel A. Elsherbini, Brandon M. Rawlings, Feras Eid | 2020-03-17 |
| 10594029 | Actuatable and adaptable metamaterials integrated in package | Shawna M. Liff, Adel A. Elsherbini, Feras Eid, Georgios Dogiamis, Thomas L. Sounart +1 more | 2020-03-17 |
| 10566672 | Waveguide connector with tapered slot launcher | Adel A. Elsherbini, Johanna M. Swan, Georgios Dogiamis, Shawna M. Liff, Aleksandar Aleksov +1 more | 2020-02-18 |
| 10492267 | Display for stretchable computing device | Adel A. Elsherbini, Nadine L. Dabby, Aleksandar Aleksov, Braxton Lathrop, Feras Eid | 2019-11-26 |
| 10484120 | Waveguide couplers and junctions to enable frequency division multiplexed sensor systems in autonomous vehicle | Georgios Dogiamis, Telesphor Kamgaing, Adel A. Elsherbini, Johanna M. Swan, Erich N. Ewy | 2019-11-19 |
| 10476545 | Communication between integrated circuit packages using a millimeter-wave wireless radio fabric | Adel A. Elsherbini, Telesphor Kamgaing, Brandon M. Rawlings, Georgios Dogiamis | 2019-11-12 |
| 10468737 | Assembly and manufacturing friendly waveguide launchers | Georgios Dogiamis, Adel A. Elsherbini, Telesphor Kamgaing | 2019-11-05 |
| 10461388 | Millimeter wave fabric network over dielectric waveguides | Telesphor Kamgaing, Georgios Dogiamis | 2019-10-29 |
| 10452571 | Microelectronic package communication using radio interfaces connected through waveguides | Telesphor Kamgaing, Adel A. Elsherbini, Georgios Dogiamis, Brandon M. Rawlings | 2019-10-22 |
| 10446461 | Complex cavity formation in molded packaging structures | Adel A. Elsherbini, Joshua D. Heppner, Shawna M. Liff | 2019-10-15 |
| 10424559 | Thermal management of molded packages | Feras Eid, Nader N. Abazarnia, Johanna M. Swan, Taesha D. Beasley, Tannaz Harirchian +1 more | 2019-09-24 |
| 10418605 | Embedded formation of wearable and flexible batteries | Veronica Strong, Feras Eid, Aranzazu MAESTRE CARO | 2019-09-17 |
| 10404499 | Dispersion compensation for waveguide communication channels | Georgios Dogiamis, Emanuel Cohen, Telesphor Kamgaing | 2019-09-03 |
| 10386204 | Integrated sensor and homologous calibration structure for resonant devices | Feras Eid, Thomas L. Sounart, Georgios Dogiamis | 2019-08-20 |
| 10368439 | Assembly architecture employing organic support for compact and improved assembly throughput | Adel A. Elsherbini, Aleksandar Aleksov, Shawna M. Liff | 2019-07-30 |