Issued Patents All Time
Showing 51–75 of 84 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9076733 | Self-aligned trench over fin | Chiahsun Tseng, Chun-Chen Yeh, Lei Zhuang | 2015-07-07 |
| 9064901 | Fin density control of multigate devices through sidewall image transfer processes | Hong He, Chiahsun Tseng, Chun-Chen Yeh | 2015-06-23 |
| 9064813 | Trench patterning with block first sidewall image transfer | Sivananda K. Kanakasabapathy, Chiahsun Tseng, Yongan Xu | 2015-06-23 |
| 9059019 | Semiconductor device including source/drain formed on bulk and gate channel formed on oxide layer | Hong He, Chiahsun Tseng, Junli Wang | 2015-06-16 |
| 9059002 | Non-merged epitaxially grown MOSFET devices | Hong He, Shogo Mochizuki, Chiahsun Tseng, Chun-Chen Yeh | 2015-06-16 |
| 9059257 | Self-aligned vias formed using sacrificial metal caps | Juntao Li, Chih-Chao Yang | 2015-06-16 |
| 9054156 | Non-lithographic hole pattern formation | Chiahsun Tseng, David V. Horak, Chun-Chen Yeh | 2015-06-09 |
| 9053965 | Partially isolated Fin-shaped field effect transistors | Hong He, Chiahsun Tseng, Chun-Chen Yeh | 2015-06-09 |
| 9054020 | Double density semiconductor fins and method of fabrication | Hong He, Chiahsun Tseng, Chun-Chen Yeh | 2015-06-09 |
| 9041094 | Finfet formed over dielectric | Hong He, Chiahsun Tseng, Chun-Chen Yeh | 2015-05-26 |
| 8986921 | Lithographic material stack including a metal-compound hard mask | Daniel C. Edelstein, Bryan G. Morris, Tuan A. Vo, Christopher J. Waskiewicz | 2015-03-24 |
| 8969213 | Non-lithographic line pattern formation | Chiahsun Tseng, David V. Horak, Chun-Chen Yeh | 2015-03-03 |
| 8969189 | Contact structure employing a self-aligned gate cap | Hong He, Chiahsun Tseng, Chun-Chen Yeh | 2015-03-03 |
| 8957478 | Semiconductor device including source/drain formed on bulk and gate channel formed on oxide layer | Hong He, Chiahsun Tseng, Junli Wang | 2015-02-17 |
| 8951850 | FinFET formed over dielectric | Hong He, Chiahsun Tseng, Chun-Chen Yeh | 2015-02-10 |
| 8916337 | Dual hard mask lithography process | John C. Arnold, Sean D. Burns, Steven J. Holmes, David V. Horak, Muthumanickam Sankarapandian | 2014-12-23 |
| 8901711 | Horizontal metal-insulator-metal capacitor | Chih-Chao Yang, Juntao Li | 2014-12-02 |
| 8883649 | Sidewall image transfer process | John C. Arnold, Matthew E. Colburn, Sean D. Burns | 2014-11-11 |
| 8872244 | Contact structure employing a self-aligned gate cap | Hong He, Chiahsun Tseng, Chun-Chen Yeh | 2014-10-28 |
| 8859433 | DSA grapho-epitaxy process with etch stop material | Jassem A. Abdallah, Matthew E. Colburn, Steven J. Holmes, Daiji Kawamura, Chi-Chun Liu +1 more | 2014-10-14 |
| 8859384 | Inductor formation with sidewall image transfer | Hsueh-Chung Chen, Hong He, Chiahsun Tseng, Chun-Chen Yeh | 2014-10-14 |
| 8835305 | Method of fabricating a profile control in interconnect structures | Chih-Chao Yang, Shyng-Tsong Chen, Samuel S. Choi, Steven J. Holmes, David V. Horak +4 more | 2014-09-16 |
| 8796812 | Self-aligned trench over fin | Chiahsun Tseng, Chun-Chen Yeh, Lei Zhuang | 2014-08-05 |
| 8735283 | Method for forming small dimension openings in the organic masking layer of tri-layer lithography | John C. Arnold, Jennifer D. Schuler | 2014-05-27 |
| 8716133 | Three photomask sidewall image transfer method | Shyng-Tsong Chen, Ryan O. Jung, Neal V. Lafferty | 2014-05-06 |